Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress
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OpenAlex topics: ZnO doping and properties · Copper Interconnects and Reliability · Copper-based nanomaterials and applications
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References (43)
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1. A study on alternative substrate for FCBGA
2. Recent advances and trends in advanced packaging10.1109/TCPMT.2022.3144461 ↗
3. mmWave antenna design in advanced fan-out technology for 5G application
4. The chip manufacturing industry: environmental impacts and eco-efficiency analysis10.1016/j.scitotenv.2022.159873 ↗
5. Research progress of interfacial adhesion force of copper plating on ajinomoto build-up films for chip substrates
6. Overview and prospect of key technologies of FCBGA substrate
7. K. Zhang, TSMC 2024 North American Technology Symposium Highlights[R], 2024.
8. Curing kinetics and mechanical properties of epoxy-cyanate ester composite films for microelectronic applications10.1021/acsomega.3c04371 ↗
9. Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates10.1039/D4LF00153B ↗
10. Cu deposition technologies for build-up film substrates towards FC-BGA10.1360/SSC-2023-0130 ↗
11. Strong adhesion of electroless plated copper by optimizing lamination temperature of epoxy composite film for advanced chip packaging substrates
12. Fine copper lines with high adhesion on high rigidity dielectrics
13. Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate10.1016/j.tsf.2016.01.010 ↗
14. Investigation of a proactive glass filler removal in IC substrate build-up films and its effect on topography and copper adhesion reliability
15. Improvements of the epoxy-copper adhesion for microelectronic applications10.1021/acsaelm.9b00290 ↗
16. Adhesion study between electroless seed layers and build-up dielectric film substrates10.1149/2.049303jes ↗
17. High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)10.1016/j.matdes.2021.109830 ↗
18. Surface-modification technology by using Radical Shower Treatment (RST) process in submicron interposer for Fan-out packaging applications
19. Study on the effects of copper oxide growth on the peel strength of copper/polyimide10.1007/s11664-007-0317-z ↗
20. Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS10.1016/S0169-4332(02)01016-4 ↗
21. An XPS study of the in-situ formation of the polyimide/copper interface10.1016/0169-4332(91)90026-G ↗
22. In-depth investigation of copper surface chemistry modification by ultrashort pulsed direct laser interference patterning10.1021/acs.langmuir.0c01625 ↗
23. Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments10.1016/j.microrel.2017.07.083 ↗
24. UV/ozone treatment for adhesion improvement of copper/epoxy interface10.1016/j.jiec.2016.10.031 ↗
25. Surface chemical characterization of copper oxide and its relationship to adhesion in formed epoxy/copper interfaces10.1080/00218469908015924 ↗
26. Causes of poor adhesion: weak boundary layers10.1021/ie51403a010 ↗
27. Elucidation of adhesive interaction between the epoxy molding compound and Cu lead frames10.1021/acsomega.1c05914 ↗
28. In-situ stress determination of electroless Cu on PCB-relevant substrates
29. Improvement of substrate and package warpage by copper plating process optimization
30. A simple approach for sonochemical synthesis of Cu2O nanoparticles with high catalytic properties10.1016/j.apt.2015.12.008 ↗
31. Preparation of octahedral Cu2O nanoparticles by a green route10.1016/j.matlet.2015.08.055 ↗
32. Green synthesis of 2D CuO nanoleaves (NLs) and its application for the reduction of p-nitrophenol10.1016/j.matlet.2015.08.061 ↗
33. Optical and structural properties of CuO nanofilm: its diode application10.1016/j.jallcom.2009.11.109 ↗
34. Optical, structural and phase transition properties of Cu2O, CuO and Cu2O/CuO: their photoelectrochemical sensor applications10.1016/j.ijhydene.2018.08.159 ↗
35. Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding10.1039/C7TC03823B ↗
36. Effect of annealing and surfactant on photoluminescence of ZnS:O2− nanoparticles10.3139/146.111247 ↗
37. Influences of Ti4+ ion on dielectric property in perovskite structure of La ferrite (LaFe1-XTiXO3)10.1016/j.jallcom.2020.155040 ↗
38. Enhanced self-healing driving force in polymer materials by regulating molecular structure
39. Effect of titanium-polymer interactions on adhesion of polymer-copper redistribution layers in advanced packaging10.1109/TDMR.2022.3141940 ↗
40. Electronic structure of Cu2O and CuO10.1103/PhysRevB.38.11322 ↗
41. Thomas · 2016
42. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors10.1016/j.apsusc.2022.155165 ↗
43. Awaja · Prog. Polym. Sci. · 2009 · 34 · 94810.1016/j.progpolymsci.2009.04.007 ↗