Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism
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OpenAlex topics: Electrodeposition and Electroless Coatings · Electrochemical Analysis and Applications · Corrosion Behavior and Inhibition
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References (48)
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1. Oxide electronics for 5G and 6G10.1038/s41928-021-00659-w ↗
2. Electroforming in the Industry 4.0 era10.1016/j.coelec.2020.02.025 ↗
3. Effects of additives with different acids on the through-silicon vias copper filling10.1016/j.mee.2018.09.002 ↗
4. Selective copper electroplating on patterned self-assembled monolayers for photovoltaic applications10.1021/acsanm.2c04291 ↗
5. A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping process10.3390/met11101664 ↗
6. Research progress of electroplated nanotwinned copper in microelectronic packaging10.3390/ma16134614 ↗
7. The role of organic additives in the localized copper plating: flat, dish, and domed shape copper bumps10.1149/1.2992224 ↗
8. FEA study on the TSV copper filling influenced by the additives and electroplating process10.1016/j.mee.2023.111981 ↗
9. Recent advances in electroplating of through-hole copper interconnection10.1007/s12678-021-00687-2 ↗
10. Influence of additives on electroplated copper films and their solder joints10.1016/j.matchar.2018.10.029 ↗
11. Expanding the use of affordable CuSO4·5H2O in ATRP techniques in homogeneous media10.1016/j.polymer.2022.124526 ↗
12. Electrochemical and fill studies of a multicomponent additive package for copper deposition10.1149/1.1376636 ↗
13. The impact of organic additives on copper trench microstructure10.1149/2.1131707jes ↗
14. Parameters determination for modelling of copper electrodeposition in through-silicon-via with additives10.1016/j.mee.2018.04.015 ↗
15. Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating10.1134/S1023193511120135 ↗
16. Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence
17. Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling10.1080/00202967.2019.1636581 ↗
18. A novel bright additive for copper electroplating: Electrochemical and theoretical study10.1007/s11581-022-04799-7 ↗
19. First synergy effects of SPS and PEG-4000 on the bottom-up filling in electroless copper plating10.1149/1.3479191 ↗
20. Microvia filling with copper electroplated with quaternary ammonium-based leveler: The evaluation of convection-dependent adsorption behavior of the leveler10.1149/2.0121802jes ↗
21. Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density10.1016/j.microrel.2023.115030 ↗
22. Strong convection-dependent adsorption of phenothiazine skeleton levelers and their application in copper electroplating10.1021/acs.jpcc.2c06888 ↗
23. Experimental and theoretical study of the new leveler basic blue 1 during copper superconformal growth10.1021/acsami.3c06567 ↗
24. Investigation of synthesized carbazole derivative Cz-BPDB as a high-performance leveler for copper electroplating10.1016/j.surfcoat.2023.129526 ↗
25. Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating10.1016/j.electacta.2021.139445 ↗
26. Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies10.1016/j.apsusc.2022.156266 ↗
27. Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating10.1016/j.electacta.2022.141541 ↗
28. Effects of controlling grain growth mode on microstructures and properties of Cu foil10.1016/j.jmrt.2023.03.127 ↗
29. Grain size effect on shearing performance of copper foil: A polycrystal plasticity investigation10.1016/j.mechmat.2022.104212 ↗
30. Copper deposition and dissolution in mixed chloride–sulphate acidic electrolytes: Cyclic voltammetry at static disc electrode10.1179/0020296714Z.000000000220 ↗
31. Electrochemical and in situ SERS study of the role of an inhibiting additive in selective electrodeposition of copper in sulfuric acid10.1016/j.elecom.2018.11.007 ↗
32. Early stages of copper microparticles electrodeposition on polypyrrole film10.1016/j.coco.2018.12.001 ↗
33. Inhibitive action and adsorption behavior of cefotaxime drug at copper/hydrochloric acid interface: Electrochemical, surface and quantum chemical studies10.1039/C6RA03316D ↗
34. A comparative study of the inhibition effects of benzotriazole and 6-aniline-1,3,5-triazine-2,4-dithiol monosodium salt on the corrosion of copper by potentiodynamic polarization, AC impedance and surface-enhanced Raman spectroscopic techniques10.1016/0169-4332(91)90051-K ↗
35. Potentiodynamic electrochemical impedance spectroscopy. Copper underpotential deposition on gold10.1016/S1388-2481(03)00075-4 ↗
36. An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy10.1007/s10800-007-9459-1 ↗
37. Magnetic effect during copper electroplating using electrochemical impedance spectroscopy10.1143/JJAP.48.076506 ↗
38. Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition10.1016/j.apsusc.2021.150982 ↗
39. Aryl modification of diketopyrrolopyrrole-based quaternary ammonium salts and their applications in copper electrodeposition10.1016/j.dyepig.2019.107559 ↗
40. Stainless steel substrate pretreatment effects on copper nucleation and stripping during copper electrowinning10.1007/s10800-020-01485-2 ↗
41. Copolymer of pyrrole and 1,4-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating10.1021/acsomega.9b03691 ↗
42. Adsorption behavior of thiadiazole derivatives as anticorrosion additives on copper oxide surface: Computational and experimental studies10.1016/j.apsusc.2019.06.253 ↗
43. A comparison of typical additives for copper electroplating based on theoretical computation10.1016/j.commatsci.2017.11.049 ↗
44. Effects of the relationship between resistivity and additive chemistries in electrochemically deposited copper films10.1143/JJAP.41.1981 ↗
45. An in situ XPS study of L-cysteine co-adsorbed with water on polycrystalline copper and gold10.1016/j.apsusc.2017.11.150 ↗
46. The chemistry of the additives in an acid copper electroplating bath: Part I. Polyethylene glycol and chloride ion10.1016/0022-0728(92)80420-9 ↗
47. A novel and controllable SERS system for crystal violet and Rhodamine B detection based on copper nanonoodle substrates10.1016/j.saa.2022.121165 ↗
48. Interface adhesion enhancement by condensed aromatic ring expansion of naphthalene imide derivatives for microvia metallization by copper electroplating10.1016/j.tsf.2021.138671 ↗