Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces
Source abstract
Abstract
Abstract Nickel-based alloys are being studied a lot currently in an effort to develop stable barrier films between solder and copper substrate. In this paper, electroplated Ni–21.4%W(Au) coating on the surfaces of copper microcones applying in low temperature solid state bonding has been investigated. X-ray diffraction (XRD) and scanning electron microscopy (SEM) result show that there is no significant change of the surface morphology Cu microcones after plating Ni–W(Au) film. SEM analysis revealed that the Ni–W alloys coating can effectively reduce the interfacial reaction and improve high-temperature anticorrosion prominently in the bonding process. A thin film of Au on the top of Ni–W layer effectively reduces the oxide layer growth. The strength of bonding joint is measured and the result reveals that this method can be used in the industry.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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