Study on fabrication of the superhydrophobic sol–gel films based on copper wafer and its anti-corrosive properties

Abstract In the present study, superhydrophobic copper wafer was prepared by a sol–gel deposition method. Different molar ratios of vinyltrimethoxysilane (VTES), ethanol (EtOH), water (H 2 O) and ammonia water (NH 3 ·OH) were involved in this research. The morphologies, chemical compositions and hydrophobicity of the films were analyzed by scanning electron microscopy (SEM), energy dispersive X-ray detector (EDX), Fourier transfer infrared spectrometer (FTIR) and water contact angle measurement (CA). It was shown by the surface morphological study that different structures, such as pyramid-shaped protrusions, nipple-shaped protrusions or ball-shaped silica particles, were distributed on the copper substrate. The films had a high water contact angle larger than 155.4°. The durability properties revealed that the films had a good superhydrophobicity deposited in 3.5 wt.% sodium chloride solution for up to 14 days.