Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode
Source abstract
Abstract
Recent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical influences of point spacing, laser energy, and pulse number. Atomic force microscopy showed that 1 µm processing spacing enabled uniform ablation grooves with optimal roughness. Two-pulse configurations achieved the most consistent surface improvement. At 12.5 W incident power, samples exhibited minimized average roughness (219 nm) with localized values reaching 208 nm, alongside 1.2 N breaking stress.
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Research context
OpenAlex topics: Laser Material Processing Techniques · Ocular and Laser Science Research · Optical Coherence Tomography Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Zhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices, Zhongshan Institute, College of Electronic and Information, University of Electronic Science and Technology of China, Zhongshan 528402, China
Shenzhen Key Laboratory of Micro/Nano Photonics and Information Technology, Optoelectronic Devices and Systems, College of Physics and Optoelectronic Engineering, Ministry of Education/Guangdong Province, State Key Lab Radio F, Shenzhen University, Shenzhen 518060, China
Funding
National Natural Science Foundation of China · Guangdong Natural Science Foundation · Key Scientific Research Project of the Department of Education of Guangdong Province · Zhongshan Social Public Welfare Science and Basic Research Project
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