Design of a Rectangular Pickup Coil Fabricated on a PCB Using WBG Power Semiconductor in Discrete Package
Source abstract
Abstract
Power semiconductors based on wide bandgap (WBG) devices are capable of fast switching and have low on-resistance. Accordingly, a fast sensor with a higher bandwidth is required for circuit inspection based on switch current measurements. Thus, it is necessary to have a current sensor in the printed circuit board (PCB) circuit for diagnosis and protection of the surface mount device (SMD) type circuit system. Accordingly, a pickup coil with the advantages of a high degree of sensor configuration freedom, wide bandwidth, and low cost can be a good alternative. This study analyzes the influence of coil shape and parameters on sensor design as a guideline for embedding a pickup coil in an SMD-type PCB circuit of a WBG power semiconductor-based, half-bridge structure. The mutual inductance and self-inductance values of the coil are considered large variables in the design of a sensor coil for simultaneously maintaining high bandwidth and sensor sensitivity. Therefore, magnetic and frequency response analyses were conducted to verify the correlation with inductance, the influence of coupling capacitance, and the influence of the magnetic field formation via the current flowing through the external trace inside the PCB. The coil model is verified and discussed through simulation and double pulse tests.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Magnetic Field Sensors Techniques · Non-Destructive Testing Techniques · Electrostatic Discharge in Electronics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical and Biomedical Engineering, Hanyang University, Seoul 04763, Korea
References (35)
Show source-provided references
1. An assessment of wide bandgap semiconductors for power devices10.1109/TPEL.2003.810840 ↗
2. A survey of wide bandgap power semiconductor devices
3. Biswas, S., Reusch, D., de Rooij, M., and Neville, T. (November, January 30). Evaluation of measurement techniques for high-speed GaN transistors. Proceedings of the 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), Albuquerque, NM, USA.10.1109/WiPDA.2017.8170530 ↗
4. Huang, B., Li, Y., Zheng, T.Q., and Zhang, Y. (2014, January 14–18). Design of overcurrent protection circuit for GaN HEMT. Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE), Pittsburgh, PA, USA.10.1109/ECCE.2014.6953784 ↗
5. An analytical switching process model of low-voltage eGaN HEMTs for loss calculation10.1109/TPEL.2015.2409977 ↗
6. Jones, E.A., Wang, F., Costinett, D., Zhang, Z., Guo, B., Liu, B., and Ren, R. (2015, January 20–24). Characterization of an enhancement-mode 650-V GaN HFET. Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE), Montreal, QC, Canada.10.1109/ECCE.2015.7309716 ↗
7. Current sensing techniques: A review10.1109/JSEN.2009.2013914 ↗
8. Xiao, C., Zhao, L., Asada, T., Odendaal, W.G., and Van Wyk, J.D. (2003, January 12–16). An overview of integratable current sensor technologies. Proceedings of the 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, Salt Lake City, UT, USA.
9. The Rogowski coil principles and applications: A review10.1109/JSEN.2014.2362940 ↗
10. Shepard, D.E., and Donald, W.Y. (2000). An Overview of Rogowski Coil Current Sensing Technology, LEM DynAmp Inc.
11. Performance analysis of Rogowski coils and the measurement of the total toroidal current in the ITER machine10.1088/1741-4326/aa86fd ↗
12. Koga, M., Tsukuda, M., Nakashima, K., and Omura, I. (2016, January 8–10). Application-specific micro Rogowski coil for power modules-Design tool, novel coil pattern and demonstration. Proceedings of the CIPS 2016 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany.
13. Marracci, M., and Tellini, B. (2019, January 20–23). Design of Accurate Rogowski Coil for High Transient Currents. Proceedings of the 2019 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Auckland, New Zealand.10.1109/I2MTC.2019.8827106 ↗
14. Mutual inductance of a precise Rogowski coil in dependence of the position of primary conductor10.1109/TIM.2008.928412 ↗
15. Wang, C., Chen, Y., Zhang, G., and Zhou, Z. (2007, January 5–8). Design of printed-circuit board Rogowski coil for highly accurate current measurement. Proceedings of the 2007 International Conference on Mechatronics and Automation, Harbin, China.10.1109/ICMA.2007.4304180 ↗
16. Gerber, D., Guillod, T., and Biela, J. (2011, January 19–23). IGBT gate-drive with PCB Rogowski coil for improved short circuit detection and current turn-off capability. Proceedings of the 2011 IEEE Pulsed Power Conference, Chicago, IL, USA.10.1109/PPC.2011.6191615 ↗
17. Wang, J., Shen, Z., Burgos, R., and Boroyevich, D. (2015, January 2–4). Design of a high-bandwidth Rogowski current sensor for gate-drive shortcircuit protection of 1.7 kV SiC MOSFET power modules. Proceedings of the 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA), Blacksburg, VA, USA.10.1109/WiPDA.2015.7369315 ↗
18. Wang, J., Shen, Z., DiMarino, C., Burgos, R., and Boroyevich, D. (2016, January 20–24). Gate driver design for 1.7 kV SiC MOSFET module with Rogowski current sensor for shortcircuit protection. Proceedings of the 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), Long Beach, CA, USA.10.1109/APEC.2016.7467921 ↗
19. Wang, J., Shen, Z., Burgos, R., and Boroyevich, D. (2016, January 18–22). Integrated switch current sensor for shortcircuit protection and current control of 1.7-kV SiC MOSFET modules. Proceedings of the 2016 IEEE Energy Conversion Congress and Exposition (ECCE), Milwaukee, WI, USA.10.1109/ECCE.2016.7855210 ↗
20. Mocevic, S., Wang, J., Burgos, R., Boroyevich, D., Stancu, C., Jaksic, M., and Peaslee, B. (2018, January 4–8). Comparison between desaturation sensing and Rogowski coil current sensing for shortcircuit protection of 1.2 kV, 300 A SiC MOSFET module. Proceedings of the 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA.10.1109/APEC.2018.8341393 ↗
21. Micro PCB Rogowski coil for current monitoring and protection of high voltage power modules10.1016/j.microrel.2016.07.011 ↗
22. Gate unit with improved short-circuit detection and turn-off capability for 4.5-kV press-pack IGBTs operated at 4-kA pulse current10.1109/TPS.2013.2280379 ↗
23. Hain, S., and Bakran, M. (2013, January 2–6). New Rogowski coil design with a high DV/DT immunity and high bandwidth. Proceedings of the 2013 15th European Conference on Power Electronics and Applications (EPE), Lille, France.10.1109/EPE.2013.6631855 ↗
24. Kojovic, L.A. (2004, January 10–13). Advanced protection solutions for improved power system dynamics performance. Proceedings of the IEEE PES Power Systems Conference and Exposition, New York, NY, USA.
25. Liu, Y., Xie, X., Hu, Y., Qian, Y., Sheng, G., and Jiang, X. (2016). A novel transient fault current sensor based on the PCB Rogowski coil for overhead transmission lines. Sensors, 16.10.3390/s16050742 ↗
26. Hybrid magnetoresistor-planar Rogowski current sensing scheme with folded trace magnetic field concentration technique10.1109/JSEN.2017.2691262 ↗
27. New side-looking Rogowski coil sensor for measuring large-magnitude fast impulse currents10.1007/s11220-014-0100-1 ↗
28. Novel designs of wideband Rogowski coils for high pulsed current measurement10.1049/iet-smt.2013.0045 ↗
29. Guillod, T., Gerber, D., Biela, J., and Muesing, A. (2012, January 6–8). Design of a PCB Rogowski Coil based on the PEEC Method. Proceedings of the 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, Germany.
30. Xue, Y., Lu, J., Wang, Z., Tolbert, L.M., Blalock, B.J., and Wang, F. (2014, January 14–18). A compact planar Rogowski coil current sensor for active current balancing of parallel-connected silicon carbide MOSFETs. Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE), Pittsburgh, PA, USA.10.1109/ECCE.2014.6954042 ↗
31. A high-bandwidth integrated current measurement for detecting switching current of fast GaN devices10.1109/TPEL.2017.2749249 ↗
32. Zhao, L., Van Wyk, J.D., and Odendaal, W.G. (2004, January 22–26). Planar embedded pick-up coil sensor for power electronic modules. Proceedings of the Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC’04, Anaheim, CA, USA.
33. Yoshikazu, K., Wada, K., Guichon, J.M., Schanen, J.L., and Roudet, J. (2018, January 4–8). Bus bar embedded rogowski coil. Proceedings of the 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA.
34. Analysis of Various Pickup Coil Designs in Nonmodule-Type GaN Power Semiconductors10.3390/s20216066 ↗
35. Ahmad, S.S., and Narayanan, G. (2017, January 18–20). Double pulse test based switching characterization of SiC MOSFET. Proceedings of the 2017 National Power Electronics Conference (NPEC), Pune, India.10.1109/NPEC.2017.8310478 ↗