Microassembly of multi-material and 3D integration enabled by programmable and universal high-precision micro-transfer printing

Abstract Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity, limiting capabilities in sorting and repairing materials and components for effective yield management during large-scale manufacturing and integration processes. In this work, we introduce a dynamically programmable micro-transfer printing system utilizing a sharp phase-changing polymer and an independently addressable microheater array to modulate adhesion through localized heating. The system demonstrates dynamically programmable capabilities for the selective transfer of various materials, including semiconductors, polymers and metals, and can handle geometries ranging from microscale chiplets to nanometer-thick films and micro-spheres. It also exhibits exceptional capabilities in 3D stacking and heterogeneous material integration, significantly advancing the manufacturability of complex microsystems. As a demonstration, we successfully perform dynamically programmable transfer of microLED chips to create arbitrarily specified patterns, offering a promising solution to the challenges of mass transfer and pixel repair in microLED display manufacturing.