Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB
Source abstract
Abstract
In this work, a concept for the detection of defects in the solder layer between a power semiconductor and the printed circuit board (PCB) is proposed. Four temperature sensors in the form of discrete diodes are placed adjacent to the semiconductor. Multiple test devices with varying fault patterns in the solder layer are subjected to a power pulse, and the temperature response at the sensors is recorded and evaluated with two different methods. Conclusions about the existence, growth, and position of solder defects are drawn from the measured data. The sensitivity and usability of the concept are discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Silicon Carbide Semiconductor Technologies · Silicon and Solar Cell Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Chair of Energy Conversion, TU Dortmund University, Dortmund, Germany
Funding
German Federal Ministry of Education and Research
References (31)
Show source-provided references
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