journal article·2025-04-25

Resistive switching characteristics of fullerene in pectin polysaccharide thin film

Shanqi Mo, Feng Zhao, Kuan Yew Cheong

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Abstract

The demand for eco-friendly, nonvolatile memory technologies in artificial intelligence and the Internet of Things highlight the need for sustainable innovations. This study explores incorporating C60 into pectin polysaccharide thin films as sustainable resistive switching random access memory (ReRAM) alternatives. Employing the SON/nC60 method, C60 was integrated into pectin at concentrations of 0.05, 0.10, 0.15, and 0.20 wt.%, enhancing resistive switching characteristics. Fourier transform infrared spectroscopy, atomic force microscopy, and semiconductor parameter analysis characterized the device’s properties. Notably, the incorporation of 0.20 wt.% C60 significantly enhanced the resistive switching performance of the pectin-based devices, achieving an increase of nearly three orders of magnitude in the ON/OFF ratio and a 1.96 times improvement in the Read Memory Window compared with pure pectin devices, while maintaining stable performance over 100 switching cycles. Higher C60 levels create a denser cross-linked network, raising the energy threshold for switching. This research suggests that pectin-C60 films are viable, environmentally responsible ReRAM materials, advancing bio-organic applications in sustainable electronics.
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Research context

OpenAlex topics: Photoreceptor and optogenetics research · Neuroscience and Neural Engineering · Advanced Memory and Neural Computing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Electronic Materials Research Group, School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, Pulau Pinang, Malaysia

Micro/Nanoelectronic and Energy Laboratory, School of Engineering and Computer Science, Washington State University, Vancouver, WA, USA

Electronic Materials Research Group, School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, Pulau Pinang, Malaysia (corresponding author: )

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