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journal article·2026-01-01Open access

Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation

Salim El Kazzi, Vejay Girija Jagadeesan, Ivan Erofeev, Sergej Pasko, Simonas Krotkus, Paweł Piotr Michałowski, Chandan Das, Utkur Mirsaidov

AIP Advances· Volume 16· Issue 1
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Source abstract

Abstract

Two-dimensional (2D) films, such as tungsten disulfide (WS2), are being considered by the microelectronics industry as promising barrier and liner systems for the back-end-of-line (BEOL) metal interconnects. To maximize their efficiency, processes to integrate large grain size 2D barriers in BEOL should be explored. In this work, we investigate the use of large grain WS2 films, which are obtained by the epitaxy of the 2D film on sapphire substrates and then transferred into the dielectric. After demonstrating that a hydrogen disulfide passivation technique can help overcome film transfer challenges, we show that large grain size 2D films have enhanced barrier efficiency. Our results are benchmarked against commercially available TaN systems, proving that thin 2D films are advantageous in reducing metal diffusion in BEOL dielectrics.
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Research context

OpenAlex topics: Copper Interconnects and Reliability · 2D Materials and Applications · Semiconductor materials and interfaces

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Physics, National University of Singapore 1 , Singapore 117551

AIXTRON SE 3 , Herzogenrath 52134,

Centre for BioImaging Sciences, Department of Biological Sciences, National University of Singapore 2 , Singapore 117557

Łukasiewicz Research Network - Institute of Microelectronics and Photonics 4 , Aleja Lotników 32/46, 02-668 Warsaw,

Applied Materials, The Alpha Science Park II 5 , Singapore 117684

Centre for Advanced 2D Materials and Graphene Research Centre, National University of Singapore 6 , Singapore 117546

Department of Materials Science and Engineering, National University of Singapore 7 , Singapore 117575

Funding

Agency for Science, Technology and Research · National Research Foundation Singapore

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