journal article·2021-01-01Open access

Charge trapping analysis in sputtered BixSe1-x based accumulation-mode FETs. II. Gate capacitance characteristics

Protyush Sahu, Jun-Yang Chen, Jian-Ping Wang

AIP Advances· Volume 11· Issue 1

Abstract

In this study, we extend the analyses done on sputtered BixSe1-x based accumulation mode FETs. Previously, we studied the basic electrical and leakage properties of these FET devices. We extend our analyses to obtain key parameters of the BixSe1-x (x = 0.44) film at various gate voltages. We start by extracting the sheet carrier density and bulk mobility for different gate voltages, using the Drude model with the previously obtained semi-empirical relationship between carrier concentration and bulk mobility for BixSe1-x. The change in sheet carrier density is a result of accumulation or depletion or majority carriers from the BixSe1-x/SiO2 interface, which show hysteretic behavior. This allows us to calculate the surface sheet carrier density and the quasi-static capacitance at various gate voltages. We use a simple capacitive model to separate the capacitance originating from the gate and the film bulk. The capacitance from the film bulk is due to the surface charge thickness and is directly dependent on the Debye length. From the change of capacitance, with respect to gate voltage, we were able to identify the characteristics of the conduction band edge and the bulk band gap/Dirac cone.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Topological Materials and Phenomena · 2D Materials and Applications · Ferroelectric and Negative Capacitance Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Physics and Astronomy, University of Minnesota 1 , 116 Church Street SE, Minneapolis, Minnesota 55455, USA

Department of Electrical and Computer Engineering, University of Minnesota 2 , 200 Union Street SE, Minneapolis, Minnesota 55455, USA

Funding

National Science Foundation · Semiconductor Research Corporation · Defense Advanced Research Projects Agency

References (19)

Show source-provided references
1. Nature Physics · 2010 · 6 · 96010.1038/nphys1861 ↗
2. Nature Physics · 2014 · 10 · 95610.1038/nphys3140 ↗
3. Physical Review Letters · 2016 · 117 · 07660110.1103/physrevlett.117.076601 ↗
4. Nature Communications · 2017 · 8 · 1418410.1038/ncomms14184 ↗
5. Physical Review Letters · 2017 · 119 · 07770210.1103/physrevlett.119.077702 ↗
6. Science · 2013 · 342 · 45310.1126/science.1239834 ↗
7. Phys. Rev. B · 2007 · 75 · 12130610.1103/physrevb.75.121306 ↗
8. Low Temperature Physics · 2019 · 45 · 11810.1063/1.5082322 ↗
9. Phys. Rev. Lett. · 2011 · 107 · 05680310.1103/physrevlett.107.056803 ↗
10. Journal of Physics and Chemistry of Solids · 2019 · 128 · 25810.1016/j.jpcs.2017.12.009 ↗
11. Scientific Reports · 2019 · 9 · 337010.1038/s41598-019-39821-y ↗
12. Nature Materials · 2018 · 17 · 80010.1038/s41563-018-0136-z ↗
13. Applied Physics Letters · 2018 · 112 · 12240210.1063/1.5020788 ↗
14. AIP Advances · 2020 · 10 · 01531510.1063/1.5130198 ↗
15. Scientific Reports · 2014 · 4 · 479410.1038/srep04794 ↗
16. Nano Letters · 2019 · 19 · 483610.1021/acs.nanolett.8b05011 ↗
17. Nature Physics · 2012 · 8 · 45910.1038/nphys2286 ↗
18. Physical Review B · 2010 · 82 · 15545710.1103/physrevb.82.155457 ↗
19. ACS Appl. Mater. Interfaces · 2018 · 10 · 3235510.1021/acsami.8b10687 ↗