Effect of interleaved Si layer on the magnetotransport and semiconducting properties of n-Si/Fe Schottky junctions
Source abstract
Abstract
Heterostructure films of the form n-Si/Si(tSi)/Fe(800 Å) were prepared by DC magnetron sputtering. In these films, the Si and Fe (800 Å) films were deposited onto n-Si(100) substrates. Substrates with different doping concentration ND were used. The thickness tSi of the interleaved Si layer is varied. For tSi = 0, the heterostructures form n-Si/Fe Schottky junctions. Structural studies on the samples as performed through XRD indicate the polycrystalline nature of the films. The magnetization data showed that the samples have in-plane easy axis of magnetization. The coercivity of the samples is of the order of 90 Oe. The I-V measurements on the samples showed nonlinear behavior. The diode ideality factor η = 2.6 is observed for the junction with ND = 1018 cm-3. The leakage current I0 increases with the increase of ND. Magnetic field has less effect on the electrical properties of the junctions. A positive magnetoresistance in the range 1 – 10 % was observed for the Si/Fe Schottky junctions in the presence of magnetic field of strength 2 T. The origin of the MR is analyzed using a model where the ratio of the currents across the junctions with and without the applied magnetic field, IH=2T/IH=0 is studied as a function of the bias voltage Vbias. The ratio IH=2T/IH=0 shows a decreasing trend with the Vbias, suggesting that the contribution to the MR in our n-Si/Fe Schottky junctions due to the spin dependent scattering is very less as compared to that due to the suppression of the impact ionization process.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Magnetic Properties and Applications · Semiconductor materials and interfaces · Magnetic properties of thin films
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Physics, Indian Institute of Technology Bombay , Mumbai 400 076, India
References (30)
Show source-provided references
1. J. Magn. Magn. Mater. · 1999 · 200 · 5710.1016/s0304-8853(99)00335-2 ↗
2. Science · 1998 · 282 · 166010.1126/science.282.5394.1660 ↗
3. Am. Sci. · 2001 · 89 · 51610.1511/2001.6.516 ↗
4. Appl. Phys. Lett. · 2004 · 84 · 152810.1063/1.1664032 ↗
5. Phys. Rev. B · 2005 · 71 · 18442810.1103/physrevb.71.184428 ↗
6. Advanced Materials · 2009 · 21 · 463610.1002/adma.200901046 ↗
7. J. Phys. D: Appl. Phys. · 2007 · 40 · 133110.1088/0022-3727/40/5/003 ↗
8. J. Phys. D: Appl. Phys. · 2008 · 41 · 11500910.1088/0022-3727/41/11/115009 ↗
9. J. Phys. D: Appl. Phys. · 2011 · 44 · 09510310.1088/0022-3727/44/9/095103 ↗
10. Phys. Rev. B · 2009 · 80 · 18442310.1103/physrevb.80.184423 ↗
11. Appl. Phys. Lett. · 2004 · 85 · 564310.1063/1.1834733 ↗
12. Appl. Phys. Lett. · 2008 · 92 · 11251210.1063/1.2900963 ↗
13. J. Phys. D: Appl. Phys. · 2008 · 41 · 13500310.1088/0022-3727/41/13/135003 ↗
14. Appl. Phys. Lett. · 2009 · 95 · 02250310.1063/1.3179152 ↗
15. J. Appl. Phys. · 2004 · 95 · 190610.1063/1.1641523 ↗
16. J. Phys. D: Appl. Phys. · 2008 · 41 · 04500510.1088/0022-3727/41/4/045005 ↗
17. J. Phys. D: Appl. Phys. · 2008 · 41 · 05200310.1088/0022-3727/41/5/052003 ↗
18. J. Appl. Phys. · 2010 · 107 · 10392210.1063/1.3429082 ↗
19. Appl. Phys. Lett. · 2007 · 90 · 22351410.1063/1.2743937 ↗
20. Thin Solid Films · 2012 · 520 · 364110.1016/j.tsf.2011.12.051 ↗
21. J. App. Phys. · 2011 · 109 · 12392410.1063/1.3600056 ↗
22. J. Phys. D: Appl. Phys. · 2009 · 42 · 18501110.1088/0022-3727/42/18/185011 ↗
23. AIP Advances · 2017 · 7 · 01520610.1063/1.4974876 ↗
24. J. Phys. D: Appl. Phys. · 2013 · 46 · 37500310.1088/0022-3727/46/37/375003 ↗
25. IEEE Trans. Mag. · 2014 · 50 · 200560410.1109/tmag.2014.2328631 ↗
26. Mater. Lett. · 2015 · 142 · 31710.1016/j.matlet.2014.12.042 ↗
27. Mater. Res. Exp. · 2017 · 4 · 03502510.1088/2053-1591/aa6327 ↗
28. Appl. Phys. Lett. · 1985 · 47 · 133310.1063/1.96271 ↗
29. 2011 · 1
30. Phys. Rev. B · 2005 · 71 · 18040610.1103/physrevb.71.180406 ↗