Investigation of defect characterization, formation mechanism, and effect in distributed feedback lasers
Source abstract
Abstract
InP, which exhibits attractive physical characteristics, such as high electron mobility, high conductivity, and high bandgap width, has always been fanatically pursued in high frequency and high speed devices in recent years. However, the inherent high density defects hinder the quality of the epitaxial layer and, even worse, impede the device’s life. Here, we found a kind of defect in the distributed feedback laser layers on an InP based substrate. A focused ion beam was employed in order to dissect the defect. The formation process was characterized using a transmission electron microscope and a high-resolution transmission electron microscope. Closer analysis reveals that defects form a subsurface damage layer between the substrate and the epitaxial layer. The subsurface damage layer already has a potentially destructive lattice, including lots of dislocations and lattice distortions, which leads to anisotropy in the interface layer. As the epitaxial film thickness increases, so does this strain relax, and dislocations form.
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Research context
OpenAlex topics: Semiconductor Quantum Structures and Devices · Advanced Surface Polishing Techniques · Semiconductor Lasers and Optical Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Shijia Photonics (Beijing) Optoelectronic Technology Co., Ltd. 1 , Beijing 100083, China
State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences 2 , Beijing 100083, China
Key Laboratory of Semiconductor Materials Science, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences 3 , Beijing 100083, China
Funding
National Key Research and Development Program of China
References (14)
Show source-provided references
1. 0.1 μm InGaAs/InAlAs/InP HEMT production process for high performance and high volume MMW applications
2. Enhanced performance of InP/InGaAs HBT phototransistor with an improved base contact design
3. A quantum-dash dual-wavelength DFB laser for optical millimeter-wave radio-over-fiber systems
4. Review of key vertical-cavity laser and modulator advances enabled by advanced MBE technology10.1116/6.0000574 ↗
5. Rotational grinding of silicon wafers—Sub-surface damage inspection10.1016/j.mseb.2003.12.008 ↗
6. Process induced sub-surface damage in mechanically ground silicon wafers10.1088/0268-1242/23/7/075038 ↗
7. 2010
8. Polishing of super-low sub-surface dam age of GaAs wafer10.1007/BF02974893 ↗
9. Surface-damage-induced threading dislocations in 6H-SiC layers grown by physical vapor transport10.1149/1.1545470 ↗
10. Surface defects in 4H-SiC homoepitaxial layers10.1016/j.npe.2020.12.001 ↗
11. Use of high temperature hydrogen annealing to remove sub-surface damage in bulk GaN10.1016/s0022-0248(02)01748-7 ↗
12. Study of mechanical damage layers of InSb wafers
13. 2010
14. Origin of growth defects in CVD diamond epitaxial films10.1016/j.diamond.2007.10.003 ↗