journal article·2021-02-01Open access

On-chip thin-film microtransformer with improved coupling factor for high frequency data transmission

Dragan Dinulovic, Mahmoud Shousha, Martin Haug

AIP Advances· Volume 11· Issue 2

Abstract

An on-chip thin-film microtransformer with an improved coupling factor is shown in this paper. In addition to the development of this component, the characterization of the microtransformer and its use in the data transmission application are presented. In comparison to previous work, this microtransformer device shows an improved coupling factor. The microtransformer is fabricated on silicon substrate using thin-film technology. The fabrication is based on damascene process and combines material deposition using only sputtering PVD (physical vapor deposition) or CVD a (chemical vapor deposition) processes and chemical-mechanical polishing (CMP) process for patterning. The microtransformer design is a solenoid type device with a magnetic bar core and interleaved winding style. For a magnetic core a CoFeB material is applied. As insulation materials, silicon dioxide and silicon nitride are implemented. The device chip size is 1.6 mm x 0.8 mm. A turns ratio of the microtransformer is 1:1, and the device shows a self-inductance of about 25 nH and an improved coupling factor with a value of 60%.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced MEMS and NEMS Technologies · Semiconductor Lasers and Optical Devices · Innovative Energy Harvesting Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Würth Elektronik EiSos GmbH Co. KG , Parkring 29, 85748 Garching, Germany

References (18)

Show source-provided references
1. IEEE Trans. Power Electronics · 2012 · 27 · 479910.1109/tpel.2012.2198891 ↗
2. Sensors · 2019 · 19 · 353510.3390/s19163535 ↗
3. IEEE Trans. on Magnetics · 2009 · 45 · 476010.1109/tmag.2009.2030590 ↗
4. IEEE Trans. on Magnetics · 2007 · 43 · 261510.1109/tmag.2007.893794 ↗
5. IEEE Trans. on Magnetics · 2011 · 47 · 167810.1109/tmag.2011.2116122 ↗
6. IEEE Trans. on Magnetics · 2016 · 52 · 840120410.1109/TMAG.2016.2515501 ↗
7. Journal of Applied Physics · 2014 · 115 · 17A31710.1063/1.4863930 ↗
8. IEEE Trans. on Magnetics · 2017 · 53 · 470010710.1109/tmag.2017.2734878 ↗
9. IEEE Trans. on Power Electronics · 2019 · 34 · 7410.1109/TPEL.2018.2847439 ↗
10. IEEE Journal of Emerging and Selected Topics in Power Electronics · 2018 · 6 · 128010.1109/jestpe.2018.2808375 ↗
11. IEEE Trans. on Magnetics · 2019 · 55 · 840120710.1109/TMAG.2019.2905985 ↗
12. 15.4 A 52% peak-efficiency >1 W isolated power transfer system using fully integrated magnetic-core transformer
13. IEEE Transactions on Industry Applications · 2019 · 55 · 506810.1109/tia.2019.2921523 ↗
14. On-chip thin film inductor for high frequency DC–DC power conversion applications
15. See http://www.ti.com/lit/ug/tidua35a/tidua35a.pdf for Highly Efficient Power and Data Transmission Design for Isolated Low Power Applications, Design Guide, Texas Instruments, 2015.
16. AIP Advance · 2020 · 10 · 01520610.1063/1.5130009 ↗
17. Journal of Applied Physics · 1998 · 83 · 343210.1063/1.367113 ↗
18. IEEE Transactions on Magnetics · 2002 · 38 · 224910.1109/tmag.2002.802781 ↗