Microstructure of YBa2Cu3Oy coated conductor using {100} ⟨001⟩ textured Cu tape with dual functions of metal substrate and electric stabilizing layer in order to develop low-cost high-TC superconducting wires
Source abstract
Abstract
A new configuration of coated conductors (CCs), REBa2Cu3Oy (RE: rare earth elements such as Sm, Eu, Gd, and Y)/(Sr, La)TiO3 conductive buffer/Ni-electroplated {100}⟨001⟩ textured Cu and SUS316 lamination tape, has been proposed to reduce material costs. This conductive buffer layer is slightly modified from the previously reported Sr (Ti, Nb)O3 conductive buffer layers by changing the substitution element and site. However, a drastic change is found in the electric resistivity of the conductive buffer layers after oxygen annealing of YBa2Cu3Oy. The resistivity of Sr(Ti, Nb)O3 conductive buffer layers increases by more than three orders of magnitude, while the resistivity of (Sr, La)TiO3 is almost maintained and only minimally increases. Microscopic structural analysis of the CCs using the newly proposed conductive buffer layer is conducted using transmission electron microscopy (TEM). A very clean interface between the metal tape and the conductive buffer layer in the 600 nm thick (Sr, La)TiO3 buffer layers is confirmed by the TEM analysis, which has no reactive layers as well as no inter-diffusion of oxygen and metal elements. This result will soon lead to the development of low-cost and high-performance CCs.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Physics of Superconductivity and Magnetism · Magnetic properties of thin films · Magnetic and transport properties of perovskites and related materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Electric Power Engineering Research Laboratory, Central Research Institute of Electric Power Industry 1 , Yokosuka, Kanagawa 240-0196, Japan
Department of Energy Science and Technology, Graduate School of Energy Science, Kyoto University 2 , Kyoto 606-8501, Japan
Funding
Advanced Low Carbon Technology Research and Development Program
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