Landau and collisional damping induced power deposition for the m = 0 mode of helicon and Trivelpiece–Gould waves in high density helicon plasmas

By considering the thermal and collisional effects in the analysis of power deposition properties of the helicon and Trivelpiece–Gould (TG) waves in radially uniform and high density (1 × 1013 cm−3) helicon plasmas, theoretical calculations indicate that both the electron temperature and the applied magnetic field have great effects on the wave power deposition. Detailed investigations show that for a typical helicon plasma electron temperature range, 3 eV–5 eV, power deposition due to the TG wave has a dominant role compared to that of the helicon wave for moderate to large (B0 ≥ 100 G) applied magnetic fields. Specifically, collisional damping induced TG wave power deposition dominates for the most of the electron temperature range.