The thickness and growth temperature dependences of soft magnetic properties and an effective damping parameter of (FeCo)-Si alloy thin films

Kyotaro Abe; Shuang Wu; Yoshitomo Tanaka; Yusuke Ariake; Isao Kanada; Tim Mewes; Gary Mankey; Claudia Mewes; Takao Suzuki

doi:10.1063/1.5079818

journal article·2019-03-01Open access

The thickness and growth temperature dependences of soft magnetic properties and an effective damping parameter of (FeCo)-Si alloy thin films

Kyotaro Abe, Shuang Wu, Yoshitomo Tanaka, Yusuke Ariake, Isao Kanada, Tim Mewes, Gary Mankey, Claudia Mewes, Takao Suzuki

AIP Advances· Volume 9· Issue 3

Publisher page Open full text

Source abstract

Abstract

The dependences of magnetic properties and effective damping parameter (αeff) on film-thickness (d) and growth temperature (Ts) for Fe69Co26Si5 alloy films are investigated. The saturation magnetization (Ms) are found to decrease from approximately 1,700 to 1,500 emu/cm3 with d for Ts = 230 °C. For 40 nm films, the magnetization remains constant over the entire range of Ts from 35 to 360 °C. The coercivity (Hc) values for Ts above 120 °C are approximately 20 Oe. Those films deposited at Ts =120 °C or higher are epitaxial with the relation of <100>FeCoSi//<110>MgO in the film plane. For the films deposited at Ts =230 °C, the αeff rapidly decreases, and then slightly increases with d. The minimum αeff value of 0.002 is obtained at Ts = 230 °C.

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Research context

Metals & alloys

OpenAlex topics: Magnetic Properties and Applications · Magnetic properties of thin films · Metallic Glasses and Amorphous Alloys

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

The Center for Materials for Information Technology, The University of Alabama 1 , Tuscaloosa, Alabama 35487, USA

Materials Development Center, TDK Corporation 2 , Narita, Chiba 286-0805, Japan

Department of Physics and Astronomy, The University of Alabama 3 , Tuscaloosa, Alabama 35487, USA

Department of Metallurgical and Materials Engineering, The University of Alabama 4 , Tuscaloosa, Alabama 35487, USA

Department of Electrical and Computer Engineering, The University of Alabama 5 , Tuscaloosa, Alabama 35487, USA

Funding

TDK Corporation

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