Measurement and simulation analysis of internal pressure in arc chamber of low-voltage molded case circuit breaker
Source abstract
Abstract
During the arc interruption process, the internal pressure in the arc chamber of a molded-case circuit breaker (MCCB) rises rapidly. In this study, the arc behavior and internal pressure in an MCCB are measured and calculated. First, using computational fluid dynamics, the internal pressure in the arc chamber is computed both with and without a baffle. In the presence of the baffle, it is found that the pressure is similar at various measurement points, whereas without the baffle, obvious differences in pressure are observed. Second, a moving model considering the contact opening process is proposed based on the relationships between the arc positions, arc area, and source terms at a typical point in time. Compared with a fixed arc model, the moving arc model provides a more precise arc distribution and pressure in the arc chamber of an MCCB.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Vacuum and Plasma Arcs · Electrical Fault Detection and Protection · Electrostatic Discharge in Electronics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University , Xi’an 710049, China
References (18)
Show source-provided references
1. 2015 · 12
2. IEEE Transactions on Power Delivery · 1999 · 14 · 36510.1109/61.754075 ↗
3. IEEE Transactions on Plasma Science · 1999 · 25 · 954
4. IEEE Transactions on Power Delivery · 1990 · 5 · 176010.1109/61.103671 ↗
5. IEEE Holm Conference on Electrical Contacts · 2000 · 24 · 161
6. International Journal of Heat and Mass Transfer · 1999 · 42 · 172310.1016/s0017-9310(98)00110-0 ↗
7. IEEE Holm Conference on Electrical Contacts · 2007 · 35 · 43
8. IEEE Transactions on Components & Packaging Technologies · 2002 · 25 · 40910.1109/tcapt.2002.804604 ↗
9. 2008 · 9
10. IEEE Transactions on Plasma Science · 2011 · 36 · 2831
11. J. Phys. D: Appl. Phys. · 1997 · 30 · 213210.1088/0022-3727/30/15/003 ↗
12. J. Phys. D: Appl. Phys. · 2013 · 46 · 27300110.1088/0022-3727/46/27/273001 ↗
13. IEEE Transactions on Components and Packaging Technologies · 2002 · 25 · 40910.1109/tcapt.2002.804604 ↗
14. IEEE Transactions on Components Packaging & Manufacturing Technology · 2014 · 4 · 63210.1109/tcpmt.2014.2300093 ↗
15. J. Phys. D: Appl. Phys. · 2004 · 37 · 59510.1088/0022-3727/37/4/011 ↗
16. J. Phys. D: Appl. Phys. · 2005 · 38 · 15310.1088/0022-3727/38/9/r01 ↗
17. IEEE Transactions on Components, Packaging, and Manufacturing Technology · 1998 · 21 · 9610.1109/95.679038 ↗
18. IEEE Transactions on Plasma Science · 2018 · 35 · 434