Pulse voltage determination for electrostatic micro manipulation considering surface conductivity and adhesion of glass particle
Source abstract
Abstract
A model with surface conductivity and adhesional force is proposed to investigate the mechanism for electrostatic micro manipulation of a dielectric object using a single probe. The manipulation system consists of three elements: a conductive probe as a manipulator, a conductive plate as a substrate, and a dielectric particle as the target object for manipulation. The particle can be successfully picked up/placed if a rectangular pulse voltage is applied between the probe and the plate. The reliability of the picking up/placing operation is improved by applying a pulse voltage that is determined by a theoretical model considering surface conductivity and adhesion. To verify the theoretical prediction, manipulation experiment is conducted using soda-lime glass particles with radii of 20 μm and 40 μm.
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Research context
OpenAlex topics: Electrowetting and Microfluidic Technologies · Surface Roughness and Optical Measurements · Near-Field Optical Microscopy
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Affiliations
Tokyo Institute of Technology 1 Dept. of Mechanical and Aerospace Engineering, Graduate School of Engineering, I1-47, 2-12-1 Meguro-ku O-okayama Tokyo, 152-8550, JAPAN
Tokyo Institute of Technology 2 Dept. of International Development Engineering, Graduate School of Engineering, I4-11, 2-12-1 Meguro-ku O-okayama Tokyo, 152-8550, JAPAN
References (32)
Show source-provided references
1. Computer · 2001 · 3410.1109/2.895117 ↗
2. IEEE Photonic. Tech. L. · 2004 · 16
3. Opt. Lett. · 2000 · 25
4. AIP Advances · 2012 · 2 · 04216910.1063/1.4769888 ↗
5. Proc. R. Soc. London Ser. A · 1971 · 324 · 30110.1098/rspa.1971.0141 ↗
6. 212
7. 1998 · 181
8. J. Appl. Phys. · 2002 · 92
9. J. Micromech. Microeng. · 2006 · 16 · 156210.1088/0960-1317/16/8/017 ↗
10. J Micro-Nano Mech. · 2008 · 4 · 7310.1007/s12213-008-0008-8 ↗
11. J. Micromech. Microeng. · 2010 · 20 · 03500910.1088/0960-1317/20/3/035009 ↗
12. 776
13. J. Fluid Mech. · 2004 · 498 · 11310.1017/S0022112003006955 ↗
14. 36
15. J. Micromech. Microeng. · 2006 · 16 · 126710.1088/0960-1317/16/7/021 ↗
16. J. Electrost. · 1997 · 40-41 · 28910.1016/S0304-3886(97)00052-1 ↗
17. Hays · 2004 · 77
18. 259
19. IEEE T. Ind. Appl. · 1999 · 35 · 53010.1109/28.766997 ↗
20. J. Phys. D Appl. Phys. · 2006 · 39 · 124910.1088/0022-3727/39/6/036 ↗
21. Sensor Actuator A · 2009 · 154 · 12310.1016/j.sna.2009.05.022 ↗
22. Sci. Technol. Adv. Mater. · 2005 · 6 · 93910.1016/j.stam.2005.08.006 ↗
23. J of Electrost. · 2009 · 67 · 85010.1016/j.elstat.2009.07.002 ↗
24. J. Instrum. · 2011 · 6 · P1001410.1088/1748-0221/6/10/P10014 ↗
25. Adv. Powder Technol. · 2011 · 22 · 60210.1016/j.apt.2010.09.001 ↗
26. J. Appl. Phys. · 2001 · 90 · 43210.1063/1.1379353 ↗
27. Appl. Phys. Lett. · 2003 · 83 · 207610.1063/1.1609039 ↗
28. J. Micromech. Microeng. · 2008 · 18 · 10700110.1088/0960-1317/18/10/107001 ↗
29. J. Micromech. Microeng. · 2010 · 20 · 02502210.1088/0960-1317/20/2/025022 ↗
30. J. Micromech. Microeng. · 2012 · 22 · 08500310.1088/0960-1317/22/8/085003 ↗
31. 733
32. J. Appl. Phys. · 2009 · 106 · 11490310.1063/1.3260252 ↗