FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
Source abstract
Abstract
The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · Diamond and Carbon-based Materials Research · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Xi’an Jiaotong University 1 Institute of Wide Band Gap Semiconductors, , Xi’an 710049, China
Mettu University 2 Department of Physics, , Mettu, Ethiopia
Funding
Xi'an Jiaotong University
References (35)
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