journal article·2013-10-01Open access

Interstitial oxygen induced Fermi level pinning in the Al2O3-based high-k MISFET with heavy-doped n-type poly-Si gates

Moon Young Yang, Katsumasa Kamiya, Kenji Shiraishi

AIP Advances· Volume 3· Issue 10

Abstract

We study the origin of substantial threshold voltage (Vth) shifts observed in Al2O3-based MISFETs with n+poly-Si gate, by focusing on the effect of an interstitial oxygen (Oi) formation in Al2O3. We observed that the Oi level in Al2O3 is 1 eV above the valence band top of Al2O3 by first-principles calculation. Therefore, Oi formation and subsequent electron transfer from Fermi level to the Oi level allows the system to overcome the energy loss by the Oi formation, which depends on the position of Fermi level. In case of n+poly-Si gate, this electron transfer across the interface occurs and results in substantial Vth shifts. The proposed mechanism reproduces experimental result and provides a good understanding of nano-interfacial interactions.
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Research context

OpenAlex topics: Semiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design · Semiconductor materials and interfaces

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Affiliations

University of Tsukuba 1 Graduate School of Pure and Applied Sciences, , 1-1-1 Tennodai, Tsukuba, Ibaraki 305-8571, Japan

Kanagawa Institute of Technology 2 Center for Basic Education and Integrated Learning, , 1030 Shimo-Ogino, Atsugi, Kanagawa 243-0292, Japan

Nagoya University 3 Graduate School of Engineering, , Chikusa, Nagoya 464-8603, Japan

References (32)

Show source-provided references
1. IEEE Trans. Electron Devices · 1998 · 45 · 68010.1109/16.661229 ↗
2. IEDM Tech. Dig.
3. Dig. Tech. Pap. Symp. VLSI Technology
4. IEEE Electron Device Lett. · 2000 · 21 · 54010.1109/55.877204 ↗
5. IEEE Trans. Electron Devices · 2002 · 49 · 84010.1109/16.998593 ↗
6. IEDM Tech. Dig.
7. IEDM Tech. Dig.
8. IEDM Tech. Dig.
9. IEDM Tech. Dig.
10. Dig. Tech. Pap. Symp. VLSI Technology
11. Dig. Tech. Pap. Symp. VLSI Technology
12. Dig. Tech. Pap. Symp. VLSI Technology
13. Jpn. J. Appl. Phys. · 2004 · 43 · L141310.1143/JJAP.43.L1413 ↗
14. J. Appl. Phys. · 1992 · 72 · 546710.1063/1.351990 ↗
15. J. Phys. IV · 1995 · 5 · 705
16. Thin Solid Films · 2001 · 35 · 398
17. J. Vac. Sci. Technol. B · 2000 · 18 · 178510.1116/1.591472 ↗
18. Dig. Tech. Pap. Symp. VLSI Technology.
19. Jpn. J. Appl. Phys. · 2013 · 52 · 04CD1110.7567/JJAP.52.04CD11 ↗
20. Phys. Chem. Chem. Phys. · 2007 · 9 · 511210.1039/b705452a ↗
21. Phys. Rev. Lett. · 2004 · 93 · 22550210.1103/PhysRevLett.93.225502 ↗
22. IEE Proc. Circuits, Devices, Syst. · 1994 · 141 · 910.1049/ip-cds:19949949 ↗
23. Chem. Phys. Lett. · 2010 · 492 · 4810.1016/j.cplett.2010.04.029 ↗
24. Phys. Rev. · 1964 · 136 · B86410.1103/PhysRev.136.B864 ↗
25. Phys. Rev. · 1965 · 140 · A113310.1103/PhysRev.140.A1133 ↗
26. Phys. Rev. B · 1994 · 49 · 1425110.1103/PhysRevB.49.14251 ↗
27. J. Chem. Phys. · 2003 · 118 · 820710.1063/1.1564060 ↗
28. J. Phys. Condens. Mater. · 2008 · 20 · 06420110.1088/0953-8984/20/6/064201 ↗
29. Microelectronic Engineering · 2009 · 86 · 175610.1016/j.mee.2009.03.059 ↗
30. J. Appl. Phys. · 2011 · 109 · 03371510.1063/1.3544310 ↗
31. 1998
32. Appl. Phys. Lett. · 2008 · 93 · 12290510.1063/1.2991287 ↗