Photo-induced tunneling currents in MOS structures with various HfO2/SiO2 stacking dielectrics
Source abstract
Abstract
In this study, the current conduction mechanisms of structures with tandem high-k dielectric in illumination are discussed. Samples of Al/SiO2/Si (S), Al/HfO2/SiO2/Si (H), and Al/3HfO2/SiO2/Si (3H) were examined. The significant observation of electron traps of sample H compares to sample S is found under the double bias capacitance-voltage (C-V) measurements in illumination. Moreover, the photo absorption sensitivity of sample H is higher than S due to the formation of HfO2 dielectric layer, which leads to larger numbers of carriers crowded through the sweep of VG before the domination of tunneling current. Additionally, the HfO2 dielectric layer would block the electrons passing through oxide from valance band, which would result in less electron-hole (e−-h+) pairs recombination effect. Also, it was found that both of the samples S and H show perimeter dependency of positive bias currents due to strong fringing field effect in dark and illumination; while sample 3H shows area dependency of positive bias currents in strong illumination. The non-uniform tunneling current through thin dielectric and through HfO2 stacking layers are importance to MOS(p) tunneling photo diodes.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Semiconductor materials and devices · Integrated Circuits and Semiconductor Failure Analysis · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
National Taiwan University Graduate Institute of Electronics Engineering/Department of Electrical Engineering, , Taipei, 10617, Taiwan
References (31)
Show source-provided references
1. IEEE computer · 2003 · 36 · 68
2. Appl. Surf. Sci. · 1998 · 135 · 13710.1016/S0169-4332(98)00286-4 ↗
3. Nature (London) · 1999 · 399 · 75810.1038/21602 ↗
4. 1997 · 930
5. IEEE Electron Device Lett. · 2009 · 30 · 103910.1109/LED.2009.2029876 ↗
6. IEEE Electron Device Lett. · 2000 · 21 · 18110.1109/55.830975 ↗
7. IEEE Electron Device Lett. · 2004 · 25 · 68110.1109/LED.2004.835791 ↗
8. IEEE Electron Device Lett. · 2004 · 25 · 63110.1109/LED.2004.833842 ↗
9. J. Appl. Phys. · 2007 · 101 · 08370410.1063/1.2717600 ↗
10. Appl. Phys. Lett. · 2008 · 92 · 21290210.1063/1.2929680 ↗
11. IEEE Non-Volatile Semiconductor memory Workshop
12. J. Appl. Phys. · 2011 · 110 · 10451410.1063/1.3662944 ↗
13. Physical and Failure Analysis of Integrated Circuits, IPFA, 1
14. Appl. Phys. Lett. · 1999 · 74 · 200510.1063/1.123728 ↗
15. J. Appl. Phys. · 2001 · 89 · 524310.1063/1.1361065 ↗
16. IEEE Trans. Electron Devices · 2006 · 53 · 92310.1109/TED.2006.870425 ↗
17. IEEE Trans. Electron Devices · 1999 · 46 · 153710.1109/16.772508 ↗
18. J. Appl. Phys. · 2006 · 100 · 09410810.1063/1.2362905 ↗
19. IEEE Integrated Reliability Workshop Final Report
20. IEEE Trans. Components, Hybrids, and Manufacturing Technology · 1982 · 5 · 12710.1109/TCHMT.1982.1135931 ↗
21. 2007
22. IEEE Trans. Electron Devices. · 1997 · 44 · 168910.1109/16.628824 ↗
23. Appl. Phys. Lett. · 2010 · 96 · 23350610.1063/1.3449128 ↗
24. IEEE Sensor Journal · 2012 · 12 · 231310.1109/JSEN.2012.2187886 ↗
25. Appl. Phys. Lett. · 1990 · 56 · 45110.1063/1.102762 ↗
26. Journal of The Electrochemical Society · 2004 · 151 · G54910.1149/1.1783907 ↗
27. International Electronic Devices and Materials Symposium
28. IEEE Trans. Electron Devices · 1999 · 46 · 150010.1109/16.772500 ↗
29. J. Appl. Phys. · 2004 · 95 · 560210.1063/1.1704850 ↗
30. Ceram. Int. · 2004 · 30 · 110110.1016/j.ceramint.2003.12.020 ↗
31. Semiconductor Optoelectronic Devices