Contributions of mass and bond energy difference and interface defects on thermal boundary conductance
Source abstract
Abstract
The impact of mass and bond energy difference and interface defects on thermal boundary conductance (TBC) is investigated using non-equilibrium molecular dynamics (NEMD) with the Lennard-Jones (L-J) interatomic potential. Results show that the maximum TBC is achieved when the mass and bond energy of two dissimilar materials are matched, although the effective thermal conductivity is not necessarily a maximum due to the contributions of the thermal conductivity of the constituent materials. Mass and bond energy differences result in a mismatch between phonon dispersions, limiting high frequency phonon transport at the interface. This frequency mismatch is defined by a frequency ratio, which is a ratio of the characteristic frequencies of the two materials, presented in the discussion section, and is a reference of the level of phonon dispersion mismatch. Inelastic scattering may result at higher temperatures, especially when there exists a bond energy difference, resulting in strain in the lattice, which would allow phonons outside the allowable frequency range to contribute to transport. TBC decreases abruptly with small mass differences, but at which point larger differences in mass have no impact. In addition, interdiffusion across the interface further reduces the TBC between the frequency ratios of 0.79 and 1.26 while vacancies have negligible impact.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Thermal properties of materials · Advanced Thermoelectric Materials and Devices · Thermal Radiation and Cooling Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Utah State University Department of Mechanical and Aerospace Engineering, , Logan, UT 84322-4130, USA
References (49)
Show source-provided references
1. Applied Physics Letter · 1987 · 51 · 220010.1063/1.98939 ↗
2. Journal of Applied Physics · 2003 · 93 · 79310.1063/1.1524305 ↗
3. Journal of Physics (USSR) · 1941 · 4 · 181
4. Canadian Journal of Physics · 1959 · 3710.1139/p59-037 ↗
5. Review of Modern Physics · 1989 · 61 · 60510.1103/RevModPhys.61.605 ↗
6. Nanoscale and Microscale Thermophysical Engineering · 2010 · 14 · 2110.1080/15567260903530379 ↗
7. Journal of Heat Transfer · 2009 · 131
8. Modelling Simul. Mater. Sci. Eng. · 1996 · 4 · 40910.1088/0965-0393/4/4/006 ↗
9. Microelectronics Journal · 2000 · 31 · 81510.1016/S0026-2692(00)00064-1 ↗
10. Physical Review B · 2003 · 67 · 20542210.1103/PhysRevB.67.205422 ↗
11. Physical Review B · 2005 · 72 · 1
12. Transactions of the ASME · 2006 · 128 · 111410.1115/1.2352781 ↗
13. IEEE Transactions on Components, Packaging and Manufacturing Technology · 2011 · 1 · 113210.1109/TCPMT.2011.2112356 ↗
14. Applied Physics Letters · 2012 · 100 · 13190610.1063/1.3698325 ↗
15. Physical Review B · 2014 · 90 · 07541110.1103/PhysRevB.90.075411 ↗
16. Applied Physics Letters · 2009 · 95
17. Nano Letters · 2011 · 11 · 61810.1021/nl103718a ↗
18. Journal of Heat Transfer · 2007 · 129 · 70510.1115/1.2717242 ↗
19. Physical Review B · 2010 · 81 · 15540810.1103/PhysRevB.81.155408 ↗
20. Solid State Communications · 1997 · 102 · 51710.1016/S0038-1098(97)00049-5 ↗
21. Journal of Applied Physics · 2008 · 10310.1063/1.2936868 ↗
22. Physical Review B · 2009 · 79 · 10430510.1103/PhysRevB.79.104305 ↗
23. Physical Review B · 2010 · 81 · 23542710.1103/PhysRevB.81.235427 ↗
24. Journal of Applied Physics · 2012 · 112 · 06431910.1063/1.4754513 ↗
25. International Journal of Heat and Mass Transfer · 2006 · 49 · 492110.1016/j.ijheatmasstransfer.2006.05.030 ↗
26. Physical Review B · 2009 · 80 · 16530410.1103/PhysRevB.80.165304 ↗
27. Physical Review B · 2011 · 8410.1103/PhysRevB.84.193301 ↗
28. Microscale Thermophysical Engineering · 2005 · 9 · 29510.1080/10893950500196469 ↗
29. International Journal of Heat and Mass Transfer · 2007 · 50 · 397710.1016/j.ijheatmasstransfer.2007.01.040 ↗
30. Physical Review B · 2013 · 87 · 09430310.1103/PhysRevB.87.094303 ↗
31. Physical Review B · 2012 · 86 · 23530410.1103/PhysRevB.86.235304 ↗
32. Physical Review B · 2012 · 86 · 05430510.1103/PhysRevB.86.054305 ↗
33. International Mechanical Engineering Congress and Exposition · 2004 · 37
34. Journal of Chemical Physics · 2004 · 120 · 384110.1063/1.1643725 ↗
35. Journal of Physics D: Applied Physics · 2009 · 42 · 09541610.1088/0022-3727/42/9/095416 ↗
36. Journal of Applied Physics · 2009 · 10510.1063/1.3056135 ↗
37. Physical Review B · 2012 · 85 · 03543810.1103/PhysRevB.85.035438 ↗
38. Phys. Chem. Chem. Phys. · 2013 · 15 · 1107810.1039/c3cp51131f ↗
39. Journal of Computational Physics · 1995 · 117 · 110.1006/jcph.1995.1039 ↗
40. International Journal of Thermal Sciences · 2004 · 44 · 54710.1016/j.ijthermalsci.2004.12.006 ↗
41. Physica B—Condensed Matter · 2004 · 349 · 27010.1016/j.physb.2004.03.247 ↗
42. 1987
43. Journal of Applied Physics · 2010 · 108 · 12351510.1063/1.3517159 ↗
44. International Journal of Thermal Sciences · 2011 · 50 · 64810.1016/j.ijthermalsci.2010.12.004 ↗
45. Physical Review B · 2013 · 88 · 15531810.1103/PhysRevB.88.155318 ↗
46. Applied Physics Letters · 2003 · 83 · 318610.1063/1.1619221 ↗
47. Computer Physics Communications · 2011 · 182 · 220110.1016/j.cpc.2011.04.019 ↗
48. Physical Review B · 1970 · 2 · 417610.1103/PhysRevB.2.4176 ↗
49. International Journal of Heat and Mass Transfer · 2004 · 47