Modeling of CuCr contact vacuum arc with consideration of its components
Source abstract
Abstract
This paper involves the simulation of vacuum arc under composite (CuCr) contact. A three dimensional model is developed and we have considered the ionization process as well as recombination in the vacuum arc. The species transport equations, in which the fraction of each component is calculated, provides the distribution of various atoms and ions in vacuum arc. The model describes ions and atoms as two different processes considering that ions are influenced by self-generated magnetic field. Atoms play an inferior role in the process of vacuum arc. They gather in an ‘atom layer’ whose thickness is no more than 1mm and outside the atom layer the density of atoms declines by at most 5 orders of magnitude. The ionization process is dominated by electron temperature. The distribution of ion species is closely related to the degree of ionization. At cathode, singly charged ions are dominant. From cathode to anode, ions are ionized so that doubly charged ions become the major component at anode where singly charged ions reach their minimum density. Finally, the ionization rate is also influenced by the ionization potential of each component, so the fraction of Cr1+ is smaller than Cu1+ while Cr2+ is larger than Cu2+ in the anode center.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Vacuum and Plasma Arcs · Advanced materials and composites · Advanced Sensor Technologies Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049, China
Funding
National Key Basic Research Programme of China · National Key Research and Development Plan of China · National Natural Science Foundation of China
References (36)
Show source-provided references
1. Boxman R. L. · Journal of Applied Physics · 1977 · 6 · 48
2. Schade E. · IEEE Transactions on Plasma Science · 2005 · 5 · 35
3. Yang D. · IEEE Transactions on Plasma Science · 2010 · 2 · 38
4. G. P. Slade (CRC Press, 2007).
5. Slade G. P. · IEEE Transactions on Components, Packaging and Manufacturing Technology · 1984 · 1 · 7
6. Shi Z. · IEEE Transactions on Plasma Science · 2009 · 8 · 37
7. Wang L. · Journal of Physics D: Applied Physics · 2005 · 7 · 38
8. 10.1063/1.238873410.1063/1.2388734 ↗
9. Lamara T. · IEEE Transactions on Plasma Science · 2013 · 8 · 41
10. Kantas S. · IEEE Transactions on Plasma Science · 2013 · 7 · 41
11. Shkol’nik S. M. · IEEE Transactions on Plasma Science · 2005 · 5 · 33
12. Dullni E. · IEEE Transactions on Plasma Science · 1989 · 6 · 17
13. Delachaux T. · IEEE Transactions on Plasma Science · 2007 · 4 · 35
14. Lee T. H. · Power Apparatus and Systems, Part III Transactions of the American Institute of Electrical Engineers · 1962 · 3 · 81
15. Wang L. · Journal of Physics D: Applied Physics · 2016 · 23 · 23520610.1088/0022-3727/49/23/235206 ↗
16. 10.1063/1.493330610.1063/1.4933306 ↗
17. Chaly A. M. · IEEE Transactions on Plasma Science · 1997 · 4 · 25
18. Methling R. · IEEE Transactions on Plasma Science · 2015 · 8 · 43
19. 10.1063/1.490373010.1063/1.4903730 ↗
20. Yushkov G. Y. · Technical Physics Letters · 2014 · 12 · 40
21. Guo H. · Plasma Chemistry and Plasma Processing · 2015 · 1 · 35
22. Kulumbaev E. B. · Technical Physics Letters · 2013 · 1 · 39
23. Wang X. · International Journal of Heat and Mass Transfer · 2015 · 8510.1016/j.ijheatmasstransfer.2015.01.132 ↗
24. Benilov M. S.
25. Benilov M. S. · IEEE International Conference on Plasma Science · 2015 · 1
26. Shmelev D. L. · IEEE Transactions on Plasma Science · 2015 · 8 · 43
27. 10.1088/1742-6596/652/1/01204110.1088/1742-6596/652/1/012041 ↗
28. Wenzel N.
29. Schade E.
30. Fuller N. E. · Industrial & Engineering Chemistry · 1966 · 5 · 58
31. Wang L. · Journal of Applied Physics · 2015 · 24 · 117
32. Wang L. · Physics of Plasmas · 2012 · 1 · 19
33. 10.1063/1.493176610.1063/1.4931766 ↗
34. Schellekens H. · Journal of Applied Physics · 1983 · 1 · 54
35. 10.1088/0022-3727/24/11/01210.1088/0022-3727/24/11/012 ↗
36. Anders A. · Physical Review E · 1997 · 1 · 55