journal article·2013-11-01Open access

Low-pressure plasma-etching of bulk polymer materials using gas mixture of CF4 and O2

Hirofumi Nabesawa, Takaharu Hiruma, Takeshi Hitobo, Suguru Wakabayashi, Toyohisa Asaji, Takashi Abe, Minoru Seki

AIP Advances· Volume 3· Issue 11

Abstract

In this study, we have proposed a low-pressure reactive ion etching of bulk polymer materials with a gas mixture of CF4 and O2, and have achieved precise fabrication of poly(methyl methacrylate) (PMMA) and perfluoroalkoxy (PFA) bulk polymer plates with high-aspect-ratio and narrow gap array structures, such as, pillar, frustum, or cone, on a nano/micro scale. The effects of the etching conditions on the shape and size of each pillar were evaluated by changing etching duration and the size/material of etching mask. The fabricated PMMA array structures indicate possibilities of optical waveguide and nanofiber array. PFA cone array structures showed super-hydrophobicity without any chemical treatments. Also, polystyrene-coated silica spheres were used as an etching mask for the pillar array structure formation to control the gap between pillars.
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Research context

OpenAlex topics: Surface Modification and Superhydrophobicity · Nanofabrication and Lithography Techniques · Advanced Sensor and Energy Harvesting Materials

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Affiliations

Chiba University 1 Department of Applied Chemistry and Biotechnology, Graduate School of Engineering, , Chiba, 263-8522, Japan

Toyama Industrial Technology Center 2 Central Research Institute, , Takaoka, 933-0981, Japan

Tateyama Machine Co. Ltd. 3 , Toyama, 930-1305, Japan

Tateyama Kagaku Industry Co. Ltd. 4 , Toyama, 930-1305, Japan

Oshima National College of Maritime Technology 5 Electronic-Mechanical Engineering Department, , Suo-Oshima, 742-2193, Japan

Graduate School of Science and Technology 6 Department of Mechanical and Production Engineering, , Niigata University, Niigata, 950-2181, Japan

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