Finite element analysis of the package structure of HgCdTe infrared focal plane array detector
Source abstract
Abstract
Reliable material parameters, correct boundary condition settings, and a reasonably simplified numerical model are key to obtain reliable and reasonable analysis results. A new finite element analysis model for the HgCdTe infrared focal plane array detector is presented, which includes the core column. The thermal stress and strain of the new model and current model are analyzed, and their distribution laws are obtained. The results are compared, and the reasons are analyzed, which can provide some references for the simulation of infrared detector package structure.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Infrared Target Detection Methodologies · Optical Systems and Laser Technology · Optical measurement and interference techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Energy and Power Engineering, University of Shanghai for Science and Technology 1 , Shanghai 200093, China
National Key Laboratory of Infrared Detection Technologies, Shanghai Institute of Technical Physic 2 , Shanghai 200083, China
Funding
Youth Innovation Promotion Association of the Chinese Academy of Sciences · Key Project of Frontier Science Research of Chinese Academy of Sciences
References (60)
Show source-provided references
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