Dual-cluster interpretation of Au–Sn binary eutectics and solders
Source abstract
Abstract
Au–Sn alloy is an important high-temperature solder, but it has some disadvantages such as high cost and brittleness. Multicomponent alloying is often performed to improve performance and reduce their cost. However, due to the absence of an atomic structure model, there has been a lack of effective theory to guide their composition design. Since Au–Sn solders are typically eutectic-based, understanding the Au–Sn eutectic at the atomic level is of great significance for clarifying the composition origin of Au–Sn solders and the subsequent multi-component composition design. In the present work, the short-range order of Au–Sn eutectics is characterized using a dual-cluster model. In the dual-cluster formulism, the two eutectics Au69.6Sn30.3 and Sn94.6Au5.4 at. % are interpreted in terms of the hypoeutectic [SnAu12]Sn2Au3 + [Au–Au2Sn6]Au3 = Au70.0Sn30.0 and [Au–Sn8]Au1 + 2{[Sn–Sn10]Sn5} = Sn95.2Au4.8 alloys, respectively. The compositions of Au–Sn solders are then analyzed based on the interpreted dual-cluster formulas, which indicate that the number of atoms of the alloying elements that replace the atoms in the dual-cluster formulas is always an integer. The present method provides a quantitative approach toward developing a practical composition interpretation and design tool for Au–Sn-based solders.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Physical Science and Technology, Dalian University 1 , Dalian 116622, China
Key Laboratory for Materials Modification by Laser, Ion and Electron Beam (Dalian University of Technology), Ministry of Education 2 , Dalian 116024, China
Funding
Dalian Youth Science and Technology Project · National Undergraduate Training Programs for Innovation and Entrepreneurship
References (36)
Show source-provided references
1. Au-Sn bonding material for the assembly of power integrated circuit module10.1016/j.jallcom.2016.02.065 ↗
2. Diffusion soldering: A new low temperature process for joining carat gold jewellery10.1007/bf03214726 ↗
3. Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures10.1016/j.msea.2004.08.053 ↗
4. High-temperature creep and hardness of eutectic 80Au/20Sn solder10.1016/j.jallcom.2006.12.142 ↗
5. Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C10.1016/j.msea.2015.11.025 ↗
6. Mechanical properties of intermetallic compounds in the Au–Sn system10.1557/jmr.2005.0269 ↗
7. A review of developments in Au-Sn eutectic alloy electrodeposition10.2174/2352094908666180907155204 ↗
8. Lead-free solders in microelectronics10.1016/s0927-796x(00)00010-3 ↗
9. Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system10.1016/j.matdes.2010.05.035 ↗
10. Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates10.1016/j.msea.2007.10.110 ↗
11. Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions10.1016/j.scriptamat.2006.12.031 ↗
12. Fluxless bonding of silicon wafers to molybdenum substrates using electroplated tin-rich solder10.1007/s10854-008-9731-0 ↗
13. Fluxless flip-chip solder joint fabrication using electroplated Sn-rich Sn-Au structures10.1109/tadvp.2006.875414 ↗
14. Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model10.1007/s10854-017-6907-5 ↗
15. Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model10.1016/j.msea.2016.03.123 ↗
16. Surface and transport properties of Au–Sn liquid alloys10.1016/j.susc.2005.10.009 ↗
17. Composition formulas of binary eutectics10.1038/srep17880 ↗
18. From clusters to phase diagrams: Composition rules of quasicrystals and bulk metallic glasses10.1088/0022-3727/40/15/r01 ↗
19. Metallic alloys10.1007/bf02751483 ↗
20. Molecule-like chemical units in metallic alloys10.1007/s40843-020-1659-1 ↗
21. Dual-cluster model of Sn-based binary eutectics and solders10.1016/j.mtcomm.2022.103191 ↗
22. Dual-cluster model of Ti–Cu binary eutectic and composition interpretation of relevant amorphous alloys10.1063/5.0044627 ↗
23. Composition origin of Cu-Zr bulk metallic glasses understood via a ‘dual-cluster’ model of binary eutectics10.1016/j.jnoncrysol.2022.121635 ↗
24. Composition interpretation of binary bulk metallic glasses via principal cluster definition10.1016/j.matdes.2016.02.020 ↗
25. Thermodynamic modeling of Au–Ce–Sn ternary system10.1016/j.calphad.2013.07.013 ↗
26. The Au–Sn (gold-tin) system10.1007/bf02872904 ↗
27. 1985
28. Nearest-neighbor coordination polyhedral clusters in metallic phases defined using Friedel oscillation and atomic dense packing10.1107/s1600576715018920 ↗
29. Determination of the enthalpy of mixing of liquid alloys using a high-temperature mixing calorimeter10.1007/bf02671966 ↗
30. Interfacial reactions of Si die attachment with Zn-Sn and Au-20Sn high temperature lead-free solders on Cu substrates10.1007/s11664-009-0770-y ↗
31. Effects of multiple reflows on microstructure and shear strength of (Au-20Sn)-2Ag/Au/Ni(P)/Kovar joints10.1016/j.msea.2020.139568 ↗
32. Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys10.1016/j.jallcom.2020.155849 ↗
33. Development of gold based solder candidates for flip chip assembly10.1016/j.microrel.2008.12.012 ↗
34. Ternary intermetallic compounds in Au–Sn soldering systems-structure and properties10.1007/s10853-015-9352-y ↗
35. Fabrication of 0.95Sn–0.05Au solder micro-bumps for flip-chip bonding10.1007/bf02665876 ↗
36. Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates10.1016/j.ijadhadh.2006.09.008 ↗