Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels
Source abstract
Abstract
The heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liquid flow channel architecture are designed in this work. Heat transfer performance tests of different TFHPs are carried out for different thermal powers. The surface temperature distribution and thermal resistance of the TFHP under different operating conditions are investigated. The experimental results show that the design of the vapor–liquid flow channel significantly impacts the TFHP’s heat transfer performance and that the wedge-shaped wick is better suited to the flow channel. The wedge-shaped wick has the lowest thermal resistance of 0.28 °C/W and the most elevated maximum thermal power of 22 W. The heat dispatch performance of the sintered wick TFHP is improved.
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Research context
OpenAlex topics: Heat Transfer and Boiling Studies · Heat Transfer and Optimization · Fluid Dynamics and Thin Films
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Faculty of Information Engineering and Automation, Kunming University of Science and Technology 1 , Kunming 650500, China
Yunnan Key Laboratory of Green Energy, Electric Power Measurement Digitalization, Control and Protection 2 , Kunming 650500, China
Funding
National Science Foundation of China
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