journal article·2020-01-01Open access

Microtransformer on silicon with CoFeB magnetic core for high-frequency signal applications

Dragan Dinulovic, Mahmoud Shousha, Martin Haug

AIP Advances· Volume 10· Issue 1

Abstract

This paper presents the development, characterization and application of a microtransformer with a bar magnetic core fabricated on silicon substrate using thin-film technology. The magnetic core, coils, and insulation layers were deposited using only sputtering PVD (physical vapor deposition) or CVD (chemical vapor deposition) processes. As insulation materials, silicon dioxide and silicon nitride are only used. The device is small with a chip size of 1600 µm x 800 µm. The transformer has a turns ratio of 1:1 and achieves a self-inductance of about 40 nH. The minimum measured breakdown voltage of the microtransformer is 1250 V(DC). The microtransformer device is applicable for frequencies up to 20 MHz. The device was fabricated on 12-inch silicon substrates on mass production equipment.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced DC-DC Converters · Induction Heating and Inverter Technology · Silicon Carbide Semiconductor Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Würth Elektronik eiSos GmbH Co. KG , Parkring 29, 85748 Garching, Germany

References (26)

Show source-provided references
1. IEEE Transactions on Magnetics · 2009 · 45 · 476010.1109/tmag.2009.2030590 ↗
2. IEEE Transactions on Magnetics · 2011 · 47 · 167810.1109/tmag.2011.2116122 ↗
3. Micro-fabricated thin-film inductors for on-chip power conversion
4. IEEE Transactions on Power Electronics · 2013 · 28 · 434210.1109/tpel.2013.2240465 ↗
5. IEEE Trans. Power Electron. · 2012 · 27 · 479910.1109/tpel.2012.2198891 ↗
6. Sensors · 2019 · 19 · 353510.3390/s19163535 ↗
7. CPSS Transactions on Power Electronics and Applications · 2017 · 2 · 29210.24295/cpsstpea.2017.00027 ↗
8. IEEE Transactions on Magnetics · 2016 · 52 · 110.1109/tmag.2016.2515501 ↗
9. IEEE Transactions on Magnetics · 2017 · 53 · 110.1109/tmag.2017.2734878 ↗
10. Journal of Applied Physics · 2014 · 115 · 17A31710.1063/1.4863930 ↗
11. IEEE Transactions on Magnetics · 2019 · 55 · 8401207
12. IEEE Transactions on Power Electronics · 2019 · 34 · 7410.1109/TPEL.2018.2847439 ↗
13. IEEE Transactions on Magnetics · 2007 · 43 · 261510.1109/tmag.2007.893794 ↗
14. IEEE Magnetics Letters · 2019 · 10 · 110.1109/lmag.2018.2887345 ↗
15. IEEE Transactions on Industry Applications · 2019 · 55 · 506810.1109/tia.2019.2921523 ↗
16. IEEE Journal of Emerging and Selected Topics in Power Electronics · 2018 · 6 · 128010.1109/jestpe.2018.2808375 ↗
17. 15.4 A 52% Peak-Efficiency >1W Isolated Power Transfer System Using Fully Integrated Magnetic-Core Transformer
18. AIP Adv. · 2018 · 8 · 04800210.1063/1.4993688 ↗
19. IEEE Trans. Power Electron. · 2013 · 28 · 439510.1109/tpel.2012.2233759 ↗
20. Application of FeCoB high-Hk hetero amorphous thin film to RF integrated inductor
21. Journal of Applied Physics · 1998 · 83 · 343210.1063/1.367113 ↗
22. IEEE Transactions on Magnetics · 2005 · 41 · 207710.1109/tmag.2005.847634 ↗
23. IEEE Transactions on Microwave Theory and Techniques · 1997 · 45 · 196110.1109/22.641804 ↗
24. Electronics Letters · 2008 · 44 · 24110.1049/el:20083010 ↗
25. Highly Efficient Power and Data Transmission Design for Isolated Low Power Applications
26. X. Qi, “High Frequency Characterization and Modeling of On-Chip Interconnects and RF IC Wire Bonds,” Ph.D. thesis, Stanford University, 2001.