journal article·2026-06-29Open access

Sub‐Terahertz Memristor Switches Using MoS 2 by Liquid–Liquid Interface Assembly

Tomás Mingates, Mohamed E. Ghatas, Jonas Deuermeier, Adam G. Kelly, Joseph Neilson, Jonathan N. Coleman, Luís Mendes, João C. Vaz, Sérgio Matos, Luca Lucci, Antonio Clemente, Zdeněk Sofer, Luís M. Pessoa, Elvira Fortunato, Rodrigo Martins, Asal Kiazadeh

Abstract

ABSTRACT This study demonstrates the first application‐ready radio‐frequency (RF) switches based on memristors fabricated via electrochemical exfoliation and liquid–liquid interfacial assembly. This 2D layer deposition method produces uniform, low‐defect bilayer molybdenum disulfide (MoS 2 ) nanosheet networks without the high temperatures or hazardous gases typical of chemical vapor deposition, providing a low‐cost, environmentally friendly route toward CMOS‐compatible integration. The resulting devices exhibit robust unipolar resistive switching, simplifying biasing and lowering power consumption compared to bipolar solutions. Devices show reproducibility with 10 4 s retention and 100‐cycle endurance. RF characterization confirms reliable operation across 10–110 GHz with low insertion loss (0.42–0.9 dB), isolation above 18 dB, and an intrinsic cut‐off frequency of ∼5.4 THz. The viability for integration into energy‐efficient wireless communication platforms is assessed by simulation of a 24 × 24 elements reconfigurable intelligent surface. High gain (>21.6 dBi) and efficient beam steering (−60°–60°) across the 26.8–29.1 GHz band demonstrate the utility of these novel non‐volatile RF switches in next‐generation mmWave communication, including 5G/6G and satellite systems.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: MXene and MAX Phase Materials · 2D Materials and Applications · Advanced Memory and Neural Computing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

CENIMAT|i3N Department of Materials Science School of Science and Technology NOVA University Lisbon and CEMOP/UNINOVA Caparica Portugal

INESC TEC – Institute for Systems and Computer Engineering Technology and Science and FEUP – Faculdade de Engenharia da Universidade do Porto Porto Portugal

School of Physics CRANN & AMBER Research Centers Trinity College Dublin Dublin Ireland

Instituto de Telecomunicações Lisbon and Instituto Politécnico De Leiria Leiria Portugal

Instituto de Telecomunicações Lisbon and Instituto Superior Técnico Universidade De Lisboa Lisbon Portugal

Instituto de Telecomunicações University Institute of Lisbon (ISCTE‐IUL) Lisbon Portugal

Université Grenoble Alpes CEA‐LETI Grenoble France

Department of Inorganic Chemistry University of Chemistry and Technology Prague Prague Czech Republic

References (56)

Show source-provided references
1. Reconfigurable Intelligent Surface With 6g for Industrial Revolution: Potential Applications and Research Challenges10.1515/pjbr-2022-0114 ↗
2. RIS‐Enabled Smart Wireless Environments: Deployment Scenarios, Network Architecture, Bandwidth and Area of Influence10.1186/s13638-023-02295-8 ↗
3. Nanoscale Memristive Radiofrequency Switches10.1038/ncomms8519 ↗
4. All‐Solid‐State Terahertz Phased Array Based on Graphene Metasurface for Ultra‐Wide‐Angle Beam Steering10.1109/JLT.2022.3150170 ↗
5. Emerging Memory Electronics for Non‐Volatile Radiofrequency Switching Technologies10.1038/s44287-023-00001-w ↗
6. 10.1049/iet‐map.2016.097410.1049/iet‐map.2016.0974 ↗
7. Monolayer Molybdenum Disulfide Switches for 6G Communication Systems10.1038/s41928-022-00766-2 ↗
8. Radiofrequency Switches Based on Emerging Resistive Memory Technologies—A Survey10.1109/JPROC.2020.3011953 ↗
9. M.ElsaidandL. M.Pessoa “Non‐Volatile Memristor‐Based 1‐Bit Reconfigurable Intelligent Surface Towards a Greener 6G ” in2024 18th European Conference on Antennas and Propagation (EuCAP)(IEEE 2024) 1–5 https://ieeexplore.ieee.org/document/10501091/.10.23919/EuCAP60739.2024.10501091 ↗
10. M.Elsaid S. I.Inácio H. M.Salgado andL. M.Pessoa “Memristor‐Based 1‐Bit Reconfigurable Intelligent Surface for 6G Communications at D‐Band ” in2024 International Conference on Electromagnetics in Advanced Applications (ICEAA)(IEEE 2024) 694–699 https://ieeexplore.ieee.org/document/10701868/.10.1109/ICEAA61917.2024.10701868 ↗
11. Application of the Memristor in Reconfigurable Electromagnetic Devices10.1109/MAP.2015.2397153 ↗
12. M. P.Jayakrishnan E.Perret A.Vena andB.Sorli “Electronically Reconfigurable Dipole Antenna Using Integrated Passive Non‐Volatile Solid‐State Metal‐Insulator‐Metal Switches ” inIEEE International Symposium on Antennas and Propagation and USNC‐URSI Radio Science Meeting(IEEE 2019) 303–304 https://ieeexplore.ieee.org/document/8888967/.10.1109/APUSNCURSINRSM.2019.8888967 ↗
13. Ultra‐Fast Switching Memristors Based on Two‐Dimensional Materials10.1038/s41467-024-46372-y ↗
14. Reconfigurable Low‐Voltage Hexagonal Boron Nitride Nonvolatile Switches for Millimeter‐Wave Wireless Communications10.1021/acs.nanolett.2c03565 ↗
15. Zero‐Static Power Radio‐Frequency Switches Based on MoS2 Atomristors10.1038/s41467-018-04934-x ↗
16. M.Kim E.Pallecchi andR.Ge “Non‐Volatile RF and Mm‐Wave Switches Based on Monolayer hBN ” inIn: 2019 IEEE International Electron Devices Meeting (IEDM)(IEEE 2019) 9.5.1–9.5.4 https://ieeexplore.ieee.org/document/8993470/.10.1109/IEDM19573.2019.8993470 ↗
17. Analogue Switches Made From Boron Nitride Monolayers for Application in 5g and Terahertz Communication Systems10.1038/s41928-020-0416-x ↗
18. Memristive Circuits Based on Multilayer Hexagonal Boron Nitride for Millimetre‐Wave Radiofrequency Applications10.1038/s41928-024-01192-2 ↗
19. Z. R.Xu Y. F.Ye L. S.Wu andJ. F.Mao “A DC∼67 GHz Memristive RF Switch Based on Conductive‐Bridging RAM on High‐Resistivity Silicon Substrate ” in2023 IEEE MTT‐S International Wireless Symposium (IWS)(IEEE 2023) 1–3 https://ieeexplore.ieee.org/document/10222107/.10.1109/IWS58240.2023.10222107 ↗
20. C.Li M.Wang andT.Chi “5G Mm‐Wave Front‐End‐Module Design With Advanced SOI Process ” inIEEE 12th International Conference on ASIC (ASICON)(IEEE 2017) 1017–1020 http://ieeexplore.ieee.org/document/8252651/.10.1109/ASICON.2017.8252651 ↗
21. C.Hillman P.Stupar andZ.Griffith “Scaleable Vanadium Dioxide Switches With Submillimeterwave Bandwidth: VO2Switches With Impoved RF Bandwidth and Power Handling ” inIEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (IEEE 2017) 1–4 http://ieeexplore.ieee.org/document/8240450/.10.1109/CSICS.2017.8240450 ↗
22. J.sun Moon H.change Seo andK.ah Son “Phase‐change RF Switches With Robust Switching Cycle Endurance ” in2018 IEEE Radio and Wireless Symposium (RWS)(IEEE 2018) 231–233 http://ieeexplore.ieee.org/document/8304995/.10.1109/RWS.2018.8304995 ↗
23. RF Power‐Handling Performance for Direct Actuation of Germanium Telluride Switches10.1109/TMTT.2019.2946145 ↗
24. B.Cetindogan B.Ustundag andE.Turkmen “A D‐Band SPDT Switch Utilizing Reverse‐Saturated SiGe HBTs for Dicke‐Radiometers ” in11th German Microwave Conference (GeMiC)(IEEE 2018) 47–50 http://ieeexplore.ieee.org/document/8335025/.10.23919/GEMIC.2018.8335025 ↗
25. Electrically Reconfigurable Terahertz Signal Processing Devices Using Liquid Metal Components10.1038/s41467-018-06463-z ↗
26. Integrated Actuation of Microfluidically Reconfigurable Mm‐Wave SPST Switches10.1109/LMWC.2019.2925889 ↗
27. Design of a Binary Programmable Transmitarray Based on Phase Change Material for Beam Steering Applications in D‐Band10.1038/s41598-024-53150-9 ↗
28. A Scheme for Enabling the Ultimate Speed of Threshold Switching in Phase Change Memory Devices10.1038/s41598-021-85690-9 ↗
29. Design of W‐Band PIN Diode SPDT Switch With Low Loss10.47037/2021.ACES.J.360712 ↗
30. S.Matos Y.Ma andQ.Luo “Reconfigurable Intelligent Surfaces for THz: Hardware Impairments and Switching Technologies ” in2024 International Conference on Electromagnetics in Advanced Applications (ICEAA)(IEEE 2024) 415–420 https://ieeexplore.ieee.org/document/10701743/.10.1109/ICEAA61917.2024.10701743 ↗
31. Recent Advances in 2D Material Theory, Synthesis, Properties, and Applications10.1021/acsnano.2c12759 ↗
32. Recent Progress of Layered Memristors Based on Two‐Dimensional MoS210.1007/s11432-023-3751-y ↗
33. Recent Progress in the Synthesis of MoS2 Thin Films for Sensing, Photovoltaic and Plasmonic Applications: A Review10.3390/ma14123283 ↗
34. Solution‐Processed Robust Multifunctional Memristor of 2D Layered Material Thin Film10.1021/acsnano.3c10775 ↗
35. Solution‐Processable 2D Semiconductors for High‐Performance Large‐Area Electronics10.1038/s41586-018-0574-4 ↗
36. Atomristor: Nonvolatile Resistance Switching in Atomic Sheets of Transition Metal Dichalcogenides10.1021/acs.nanolett.7b04342 ↗
37. Production of Ultrathin and High‐Quality Nanosheet Networks via Layer‐by‐Layer Assembly at Liquid–Liquid Interfaces10.1021/acsnano.4c09745 ↗
38. Tiled Monolayer Films of 2D Molybdenum Disulfide Nanoflakes Assembled at Liquid/Liquid Interfaces10.1021/acsami.0c03794 ↗
39. Mechanisms of Resistive Switching in Two‐Dimensional Monolayer and Multilayer Materials10.1038/s41563-025-02170-5 ↗
40. 10.1088/1361‐6528/acb69d10.1088/1361‐6528/acb69d ↗
41. Conductance Quantization in Resistive Random Access Memory10.1186/s11671-015-1118-6 ↗
42. 10.1038/s41699‐025‐00533‐910.1038/s41699‐025‐00533‐9 ↗
43. P.ColestockandM.Foley “A Generalized TRL Algorithm for s‐Parameter De‐Embedding ” accessed April (1993) http://www.osti.gov/servlets/purl/10171677‐2lpMkG/.10.2172/10171677 ↗
44. A.Orii M.Suizu andS.Amakawa “On the Length of THRU Standard for TRL De‐Embedding on Si Substrate Above 110 GHz ” in2013 IEEE International Conference on Microelectronic Test Structures (ICMTS)(IEEE 2013) 81–86 http://ieeexplore.ieee.org/document/6528150/.10.1109/ICMTS.2013.6528150 ↗
45. A Multiline Method of Network Analyzer Calibration10.1109/22.85388 ↗
46. 10.1109/TAP.2023.329108710.1109/TAP.2023.3291087 ↗
47. Experimental Validation of a 2‐Bit Reconfigurable Unit‐Cell for Transmitarrays at Ka‐Band10.1109/ACCESS.2020.3003698 ↗
48. 10.1109/TAP.2011.215233810.1109/TAP.2011.2152338 ↗
49. 10.1109/TAP.2012.218971610.1109/TAP.2012.2189716 ↗
50. MA‐COM Technology Solutions. MACOM Product Datasheet MA4AGP907 and MA4AGFCP910 AlGaAs flip chip PIN diodeshttps://www.macom.com/products/product‐detail/MA4AGP907.
51. MA‐COM Technology Solutions. MACOM Product Datasheet. MA4AGBLP912 AlGaAs flip chip PIN diodes https://www.macom.com/products/product‐detail/MA4AGBLP912.
52. Fundamental Insights Into Bulk Polyvinylpyrrolidone (PVP): Combining DFT, Molecular Dynamics, and Spectroscopic Techniques10.1016/j.chemphys.2025.113053 ↗
53. 10.3390/nano1409075910.3390/nano14090759 ↗
54. Electrical, Optical and Dielectric Properties of Polyvinylpyrrolidone/Graphene Nanoplatelet Nanocomposites10.1016/j.optmat.2023.113823 ↗
55. 10.1021/nn203879f10.1021/nn203879f ↗
56. 10.1002/adma.20110396510.1002/adma.201103965 ↗