Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices (Adv. Sci. 20/2025)
Source abstract
Abstract
Flexible Printed Electronics In article number 2415272, Wedyan Babatain and co-workers introduce a laser-enabled, additive process for fabricating flexible, double-sided PCBs. The E-LIG process combines laser-induced graphene patterning with copper electrodeposition, creating high-resolution circuits that integrate sensors and actuators directly on flexible or transparent substrates. This scalable method is ideal for wearables, soft robotics, and interactive smart surfaces.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Semiconductor Lasers and Optical Devices · Additive Manufacturing and 3D Printing Technologies · Advanced Materials and Mechanics
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