Alphabet Handwriting Recognition: From Wood‐Framed Hydrogel Arrays Design to Machine Learning Decoding
Source abstract
Abstract
Abstract Handwriting recognition is a highly integrated system, demanding hardware to collect handwriting signals and software to deal with input data. Nonetheless, the design of such a system from scratch with sustainable materials and an easily accessible computing network presents significant challenges. In pursuit of this goal, a flexible, and electrically conductive wood‐derived hydrogel array is developed as a handwriting input panel, enabling recognizing alphabet handwriting assisted by machine learning technique. For this, lignin extraction‐refill, polypyrrole coating, and polyacrylic acid filling, endowing flexibility, and electrical conduction to wood are sequentially implemented. Subsequently, these woods are manufactured into a 5 × 5 array, creating a matrix of signals upon handwriting. Efficient handwritten recognition is then achieved through appropriate manual feature extraction and algorithms with low complexity within a computing network, as demonstrated in this work, the strategic choice of expertise‐based feature engineering and simplified algorithms effectively boost the overall model performance on handwriting recognition. With potential adaptability, further applications in customized wearable devices and hands‐on healthcare appliances are envisioned.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Environmental Engineering Henan University of Technology Zhengzhou 450001 China
Department of Applied Physics Aalto University Aalto FI‐00076 Finland
College of Energy Xiamen University Xiamen 361102 China
Department of Materials Science Advanced Coatings Research Center of Ministry of Education of China Fudan University Shanghai 200433 China
Funding
China Scholarship Council
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