journal article·2019-12

Integration of MoS2 with InAlAs/InGaAs Heterojunction for Dual Color Detection in Both Visible and Near‐Infrared Bands

Jianan Deng, Lingyi Zong, Wenzhong Bao, Mingsai Zhu, Fuyou Liao, Zhongxun Guo, Yuying Xie, Bingrui Lu, Jing Wan, Jiahe Zhu, Ruwen Peng, Yifang Chen

Advanced Optical Materials· Volume 7· Issue 23
Publisher page

Abstract

Abstract At present, dual‐channel or even multi‐channel recording is a developing trend in the field of photodetection, which is widely applied in environment protection, security, and space science and technology. This paper proposes a novel MoS2/InAlAs/InGaAs n–i–n heterojunction phototransistor by integrating multi‐layered MoS2 with InGaAs‐based high electron mobility transistors (InGaAs‐HEMTs). Due to the internal photocurrent amplification in the InGaAs channels with a narrow energy bandgap of 0.79 eV, this device exhibits high photoresponsivity (R) of over 8 × 105 A W–1 under near‐infrared illumination of 1550 nm at 500 pW. Furthermore, with the combination of the photoconductance effect in the vertical MoS2/InAlAs/InGaAs n–i–n heterojunction and the photogating effect in the lateral phototransistor, this device possesses a unique characteristic under visible illumination that its photoresponsivity can be tuned by the top gate electrode from 6 × 105 A W–1 to ‐4 × 105 A W–1 by gate voltage. This may lead to a new application as an optically controlled electronic inverter, which needs further study in depth. This MoS2/InAlAs/InGaAs phototransistor builds up a new bridge between 2D materials and conventional ternary compounded semiconductor devices.
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Research context

OpenAlex topics: 2D Materials and Applications · Ga2O3 and related materials · Nanowire Synthesis and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of ASIC and System School of Information Science and Technology Fudan University Shanghai 200433 China

State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai 200433 China

School of Electronic Science and Engineering Nanjing University Nanjing 210093 China

National Laboratory of Solid State Microstructures School of Physics and Collaborative Innovation Center of Advanced Microstructures Nanjing University Nanjing 210093 China

Funding

National Natural Science Foundation of China · National Basic Research Program of China

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