3D Printing: Decal Electronics: Printable Packaged with 3D Printing High‐Performance Flexible CMOS Electronic Systems (Adv. Mater. Technol. 1/2017)
Source abstract
Abstract
In article number 1600175, Muhammad M. Hussain and co-workers report a highly manufacturable heterogeneous integration strategy to combine complementary metal oxide semiconductor electronics, inkjet printing for interconnection, 3D printing for packaging, and roll-to-roll printing of decal electronics. The flexible electronic system shows reliable electrical performance, large-scale integration density as well as multifunctionality under extreme mechanical conditions.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Additive Manufacturing and 3D Printing Technologies
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Affiliations
Integrated Nanotechnology Lab and Integrated Disruptive Electronic Applications (IDEA) Lab Computer, Electrical, Mathematical Science and Engineering Division King Abdullah University of Science and Technology (KAUST) Thuwal 23955‐6900 Saudi Arabia
Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe) Computer, Electrical, Mathematical Science and Engineering Division King Abdullah University of Science and Technology (KAUST) Thuwal 23955‐6900 Saudi Arabia
References
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