Emerging Trends in 2D Flexible Electronics
Source abstract
Abstract
Abstract Potential for integrated flexible electronics has been shown for 2D materials with atomically thin layers and dangling‐bond‐free surfaces. Strain engineering is a fascinating technique for tuning or controlling the electronic and optical properties of 2D materials. In the review article, an effort to condense the most recent and promising approaches that can be used to create flexible nanoelectronic and optoelectronic devices in the future and expand their range of useful applications is made. In order to investigate their electrical behavior, the majority of the devices are created using chemical vapor deposition (CVD) or mechanical exfoliation of ultrathin 2D TMD materials. This makes it possible to develop flexible piezo‐phototronic photodetectors, self‐powered sensors, and wearable and implantable devices with higher strain tolerance. On the basis of 2D TMDs materials, a comparison of the performance and characteristics of 2D flexible electronic devices is also carried out. In order to advance the development of wearable and implantable electronics with greater strain tolerance for health monitoring and usher in a new era of flexible technologies, this overview of recent research on 2D flexible electronics based on nanomaterials is intended to aid in the advancement of the field. Finally, it summarizes the current challenges and opportunities.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · 2D Materials and Applications · MXene and MAX Phase Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Intelligent Mechatronics Engineering Sejong University Seoul 05006 South Korea
Research Center for Advanced Materials Science (RCAMS) King Khalid University P. O. Box 9004 Abha 61413 Saudi Arabia
Department of Physics Faculty of Science King Khalid University P.O. Box 9004 Abha 61413 Saudi Arabia
School of Engineering Science Simon Fraser University Burnaby British Columbia V5A 1S6 Canada
Funding
National Research Foundation of Korea
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