Laser Cutting of Metal‐Halide‐Perovskite Wafers for X‐Ray Detector Integration

Abstract To realize various applications, structuring methods of metal‐halide perovskites are of great importance. Most of the common techniques have focused on thin layers and suffer from limitations for thick layers. But thicknesses of several hundred micrometers are necessary, especially for the application field of medical X‐ray detection. In order to scale perovskite‐based X‐ray detectors from small laboratory devices to realistic product sizes, new manufacturing strategies such as laser cutting are necessary. Here the potential of structuring any configurable geometry out of thick, freestanding methylammonium lead iodide (MAPbI₃) wafers with ultrashort pulse (USP) laser at a wavelength of 1064 nm, is shown. A small difference in the laser parameters causes a significant variation of the perovskite from material decomposition to almost no effects. With the chosen parameter set of the USP laser, the MAPbI₃ wafer can be shaped so that just slight changes in the morphology and no difference in the X‐ray performance can be seen. This method offers the possibility of scaling up perovskite X‐ray detectors in the future without significant signal loss.