Multiprocess Laser Lifting‐Off for Nanostructured Semiconductive Hydrogels

Abstract Semiconductive hydrogels denote a strategically valuable platform associated with interdiscipline fields by double advantages of metals and organisms (eco‐friendliness, structural flexibility, mixed conduction, real‐time responsiveness, scalable fabrication, and chemical stability). Nevertheless, the orthodox chemical/physical methods processing hydrogels yield planar‐like layers or rough structures without ultrafine feature size or manipulative performance, falling short of µ‐robotics, µ‐electronics, or n‐energy industries. Thereby, scaling the device's volume down and unleashing material's potential become crucially important for broadband applications. A femtosecond laser lifting‐off technique is synthesized with self‐assembly to break conventional volume/resolution limitation, enlarge the geometry‐design capacity, and desirable electricity conduction for micro/nanosituations. Low‐dimensional high‐performance nanowires, electric circuits, ultrathin interdigital capacitors, manipulative photon filters, and metasurfaces are functionalized here. The repeated experiment concludes a high‐density integration ability with a subminiature size down to 10 × 10 × 0.02 µm³, tunable electric conductivity up to 1.17 × 10⁵ S m⁻¹, and areal capacitance >16.2 mF cm⁻² for energy storage higher than those electrochemical double‐layer ones. Large geometry capacity with nanometric resolution provides access to future‐perspective optoelectronic products, n‐energy, bioneural recordings, or interfaces of embedding conditions.