A Wafer‐Scale Nanoporous 2D Active Pixel Image Sensor Matrix with High Uniformity, High Sensitivity, and Rapid Switching

Abstract 2D transition‐metal dichalcogenides (TMDs) have been successfully developed as novel ubiquitous optoelectronics owing to their excellent electrical and optical characteristics. However, active‐matrix image sensors based on TMDs have limitations owing to the difficulty of fabricating large‐area integrated circuitry and achieving high optical sensitivity. Herein, a large‐area uniform, highly sensitive, and robust image sensor matrix with active pixels consisting of nanoporous molybdenum disulfide (MoS ₂ ) phototransistors and indium–gallium–zinc oxide (IGZO) switching transistors is reported. Large‐area uniform 4‐inch wafer‐scale bilayer MoS ₂ films are synthesized by radio‐frequency (RF) magnetron sputtering and sulfurization processes and patterned to be a nanoporous structure consisting of an array of periodic nanopores on the MoS ₂ surface via block copolymer lithography. Edge exposure on the nanoporous bilayer MoS ₂ induces the formation of subgap states, which promotes a photogating effect to obtain an exceptionally high photoresponsivity of 5.2 × 10 ⁴ A W ⁻¹ . A 4‐inch‐wafer‐scale image mapping is successively achieved using this active‐matrix image sensor by controlling the device sensing and switching states. The high‐performance active‐matrix image sensor is state‐of‐the‐art in 2D material‐based integrated circuitry and pixel image sensor applications.