Hardware and Information Security Primitives Based on 2D Materials and Devices
Source abstract
Abstract
Abstract Hardware security is a major concern for the entire semiconductor ecosystem that accounts for billions of dollars in annual losses. Similarly, information security is a critical need for the rapidly proliferating edge devices that continuously collect and communicate a massive volume of data. While silicon‐based complementary metal‐oxide‐semiconductor technology offers security solutions, these are largely inadequate, inefficient, and often inconclusive, as well as resource intensive in time, energy, and cost, leading to tremendous room for innovation in this field. Furthermore, silicon‐based security primitives have shown vulnerability to machine learning (ML) attacks. In recent years, 2D materials such as graphene and transition metal dichalcogenides have been intensely explored to mitigate these security challenges. In this review, 2D‐materials‐based hardware security solutions such as camouflaging, true random number generation, watermarking, anticounterfeiting, physically unclonable functions, and logic locking of integrated circuits (ICs) are summarized with accompanying discussion on their reliability and resilience to ML attacks. In addition, the role of native defects in 2D materials in developing high entropy hardware security primitives is also examined. Finally, the existing challenges for 2D materials, which must be overcome for large‐scale deployment of 2D ICs to meet the security needs of the semiconductor industry, are discussed.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Physical Unclonable Functions (PUFs) and Hardware Security · Ferroelectric and Negative Capacitance Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Electrical Engineering and Computer Science Penn State University University Park PA 16802 USA
Engineering Science and Mechanics Penn State University University Park PA 16802 USA
Materials Science and Engineering Penn State University University Park PA 16802 USA
Materials Research Institute Penn State University University Park PA 16802 USA
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