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journal article·2021-06Open access

Enhancing Light–Matter Interactions in MoS2 by Copper Intercalation

Chen Stern, Avraham Twitto, Rifael Z. Snitkoff, Yafit Fleger, Sabyasachi Saha, Loukya Boddapati, Akash Jain, Mengjing Wang, Kristie J. Koski, Francis Leonard Deepak, Ashwin Ramasubramaniam, Doron Naveh

Advanced Materials· Volume 33· Issue 23
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Abstract

Abstract The intercalation of layered compounds opens up a vast space of new host–guest hybrids, providing new routes for tuning the properties of materials. Here, it is shown that uniform and continuous layers of copper can be intercalated within the van der Waals gap of bulk MoS2 resulting in a unique Cu–MoS2 hybrid. The new Cu–MoS2 hybrid, which remains semiconducting, possesses a unique plasmon resonance at an energy of ≈1eV, giving rise to enhanced optoelectronic activity. Compared with high‐performance MoS2 photodetectors, copper‐enhanced devices are superior in their spectral response, which extends into the infrared, and also in their total responsivity, which exceeds 104 A W−1. The Cu–MoS2 hybrids hold promise for supplanting current night‐vision technology with compact, advanced multicolor night vision.
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Research context

Electronic materials

OpenAlex topics: 2D Materials and Applications · Chalcogenide Semiconductor Thin Films · Perovskite Materials and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Faculty of Engineering Bar‐Ilan University Ramat‐Gan 52900 Israel

Institute for Nanotechnology and Advanced Materials Bar‐Ilan University Ramat‐Gan 52900 Israel

Nanostructured Materials Group International Iberian Nanotechnology Laboratory Avenida Mestre José Veiga s/n Braga 4715‐330 Portugal

Electron Microscopy Group Defence Metallurgical Research Laboratory (DMRL) Hyderabad 500058 India

Department of Chemical Engineering University of Massachusetts Amherst MA 01003 USA

Department of Chemistry University of California Davis Davis CA 95616 USA

Department of Mechanical and Industrial Engineering University of Massachusetts Amherst MA 01003 USA

Funding

National Science Foundation · Israel Science Foundation · Horizon 2020 Framework Programme

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