journal article·2019-12

Remotely Triggered Assembly of 3D Mesostructures Through Shape‐Memory Effects

Jun Kyu Park, Kewang Nan, Haiwen Luan, Ning Zheng, Shiwei Zhao, Hang Zhang, Xu Cheng, Heling Wang, Kan Li, Tao Xie, Yonggang Huang, Yihui Zhang, Seok Kim, John A. Rogers

Advanced Materials· Volume 31· Issue 52
Publisher page

Abstract

Abstract 3D structures that incorporate high‐performance electronic materials and allow for remote, on‐demand 3D shape reconfiguration are of interest for applications that range from ingestible medical devices and microrobotics to tunable optoelectronics. Here, materials and design approaches are introduced for assembly of such systems via controlled mechanical buckling of 2D precursors built on shape‐memory polymer (SMP) substrates. The temporary shape fixing and recovery of SMPs, governed by thermomechanical loading, provide deterministic control over the assembly and reconfiguration processes, including a range of mechanical manipulations facilitated by the elastic and highly stretchable properties of the materials. Experimental demonstrations include 3D mesostructures of various geometries and length scales, as well as 3D aquatic platforms that can change trajectories and release small objects on demand. The results create many opportunities for advanced, programmable 3D microsystem technologies.
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Research context

OpenAlex topics: Advanced Materials and Mechanics · Advanced Sensor and Energy Harvesting Materials · Polymer composites and self-healing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Sciences and Engineering University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

Department of Bioengineering Harvard University Cambridge MA 02138 USA

Center for Bio‐Integrated Electronics Department of Mechanical Engineering Department of Civil and Environmental Engineering Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

State Key Laboratory of Chemical Engineering College of Chemical and Biological Engineering Zhejiang University Hangzhou 310027 P. R. China

Department of Mechanical Engineering Department of Civil and Environmental Engineering Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

School of Aeronautic Science and Engineering Beihang University Beijing 100191 P. R. China

Applied Mechanics Laboratory Department of Engineering Mechanics Center for Flexible Electronics Technology Tsinghua University Beijing 100084 P. R. China

Department of Engineering University of Cambridge Cambridge CB2 1PZ UK

Departments of Materials Science and Engineering Biomedical Engineering Neurological Surgery, Chemistry, Mechanical Engineering Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Funding

Army Research Office · National Natural Science Foundation of China · Tsinghua National Laboratory for Information Science and Technology · National Science Foundation · Multidisciplinary University Research Initiative

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