Photoreactive and Metal‐Platable Copolymer Inks for High‐Throughput, Room‐Temperature Printing of Flexible Metal Electrodes for Thin‐Film Electronics
Source abstract
Abstract
Photoreactive and metal-platable copolymer inks are reported for the first time to allow high-throughput printing of high-performance flexible electrodes at room temperature. This new copolymer ink accommodates various types of printing technologies, such as soft lithography molding, screen printing, and inkjet printing. Electronic devices including resistors, sensors, solar cells, and thin-film transistors fabricated with these printed electrodes show excellent electrical performance and mechanical flexibility. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies · Conducting polymers and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Nanotechnology Center Institute of Textiles and Clothing The Hong Kong Polytechnic University Hong Kong China
Advanced Research Centre for Fashion and Textiles The Hong Kong Polytechnic University Shenzhen Research Institute Shenzhen 518000 China
School of Electronic and Computer Engineering The Shenzhen Graduate School Peking University Shenzhen 518055 China
Funding
Hong Kong Polytechnic University · National Natural Science Foundation of China
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