Flexible Gallium Nitride for High‐Performance, Strainable Radio‐Frequency Devices
Source abstract
Abstract
Abstract Flexible gallium nitride (GaN) thin films can enable future strainable and conformal devices for transmission of radio‐frequency (RF) signals over large distances for more efficient wireless communication. For the first time, strainable high‐frequency RF GaN devices are demonstrated, whose exceptional performance is enabled by epitaxial growth on 2D boron nitride for chemical‐free transfer to a soft, flexible substrate. The AlGaN/GaN heterostructures transferred to flexible substrates are uniaxially strained up to 0.85% and reveal near state‐of‐the‐art values for electrical performance, with electron mobility exceeding 2000 cm2 V−1 s−1 and sheet carrier density above 1.07 × 1013 cm−2. The influence of strain on the RF performance of flexible GaN high‐electron‐mobility transistor (HEMT) devices is evaluated, demonstrating cutoff frequencies and maximum oscillation frequencies greater than 42 and 74 GHz, respectively, at up to 0.43% strain, representing a significant advancement toward conformal, highly integrated electronic materials for RF applications.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: GaN-based semiconductor devices and materials · Acoustic Wave Resonator Technologies · Radio Frequency Integrated Circuit Design
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Air Force Research Laboratory Materials and Manufacturing Directorate Wright‐Patterson AFB OH 45433 USA
Air Force Research Laboratory Sensors Directorate Wright‐Patterson AFB OH 45433 USA
KBRwyle Dayton OH 45431 USA
Funding
Air Force Office of Scientific Research
References (47)
Show source-provided references
1. 10.1109/MWC.2016.772173510.1109/MWC.2016.7721735 ↗
2. 10.1109/JEDS.2014.236378910.1109/JEDS.2014.2363789 ↗
3. Jung Y. H. · IEEE Trans. Electron Devices · 2017 · 64 · 5
4. 10.1109/TMTT.2012.218753510.1109/TMTT.2012.2187535 ↗
5. 10.1063/1.10977510.1063/1.109775 ↗
6. 10.1063/1.11211610.1063/1.112116 ↗
7. 4G Americas 5G Technology Evolution Recommendations(accessed: October2015).
8. Whelan C. S. · 2012
9. 10.1109/LED.2015.247426510.1109/LED.2015.2474265 ↗
10. Du Toit N. D. · Microwave J. · 2010 · 53 · 90
11. 10.1016/j.mssp.2016.01.00810.1016/j.mssp.2016.01.008 ↗
12. 10.1016/j.sse.2005.06.02210.1016/j.sse.2005.06.022 ↗
13. 10.1143/JJAP.50.04100110.1143/JJAP.50.041001 ↗
14. 10.1016/S0167-577X(02)00414-710.1016/S0167-577X(02)00414-7 ↗
15. 10.1063/1.12081610.1063/1.120816 ↗
16. 10.1063/1.12346310.1063/1.123463 ↗
17. N. P.Pham M.Rosmeulen Z.Li D.Sabuncuoglu H.Osman presented at 2013 IEEE 15th Electronics Packaging Technology Conf. (EPTC 2013) Singapore December2013.
18. 10.1109/LED.2016.254292110.1109/LED.2016.2542921 ↗
19. 10.1002/adom.20150052610.1002/adom.201500526 ↗
20. 10.1109/LED.2010.209125110.1109/LED.2010.2091251 ↗
21. 10.1002/pssa.20160048410.1002/pssa.201600484 ↗
22. 10.1038/srep3758810.1038/srep37588 ↗
23. 10.1109/TSM.2016.259983910.1109/TSM.2016.2599839 ↗
24. 10.1038/nature1097010.1038/nature10970 ↗
25. M.Hiroki K.Kumakura Y.Kobayashi T.Akasaka H.Yamamoto T.Makimoto presented at 2014 4th IEEE Int. Workshop on Low Temperature Bonding for 3D Integration (LTB‐3D) Tokyo Japan July2014.
26. 10.1063/1.494826010.1063/1.4948260 ↗
27. 10.1038/ncomms583610.1038/ncomms5836 ↗
28. 10.1016/j.jcrysgro.2016.11.08810.1016/j.jcrysgro.2016.11.088 ↗
29. 10.7567/APEX.7.07100410.7567/APEX.7.071004 ↗
30. 10.7567/APEX.6.06100310.7567/APEX.6.061003 ↗
31. 10.1002/adma.20110382910.1002/adma.201103829 ↗
32. 10.1557/jmr.2016.26010.1557/jmr.2016.260 ↗
33. 10.1016/j.jcrysgro.2016.06.01210.1016/j.jcrysgro.2016.06.012 ↗
34. 10.1016/j.jcrysgro.2016.06.03810.1016/j.jcrysgro.2016.06.038 ↗
35. 10.1016/j.actamat.2009.12.00210.1016/j.actamat.2009.12.002 ↗
36. 10.1038/nmat153210.1038/nmat1532 ↗
37. 10.1002/smll.20050016610.1002/smll.200500166 ↗
38. 10.1088/0953-8984/14/13/30210.1088/0953-8984/14/13/302 ↗
39. 10.1063/1.493553710.1063/1.4935537 ↗
40. 10.1088/0268-1242/31/6/06500810.1088/0268-1242/31/6/065008 ↗
41. 10.1007/s11432-008-0056-710.1007/s11432-008-0056-7 ↗
42. E.Zanoni M.Meneghini G.Meneghesso D.Bisi I.Rossetto A.Stocco presented at 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) Blacksburg Virginia USA November2015.
43. 10.1063/1.234983710.1063/1.2349837 ↗
44. 10.1109/LED.2010.204709210.1109/LED.2010.2047092 ↗
45. 10.1109/TED.2016.253280610.1109/TED.2016.2532806 ↗
46. 10.1109/TED.2006.87057110.1109/TED.2006.870571 ↗
47. 10.1109/LED.2015.241697810.1109/LED.2015.2416978 ↗