Does a Morphotropic Phase Boundary Exist in Zr x Hf 1‐x O 2 ‐Based Thin Films?
Source abstract
Abstract
Abstract Zr x Hf 1‐x O 2 ‐based materials have attracted considerable interest due to their excellent scalability and compatibility with complementary metal‐oxide‐semiconductor technology. Following the discovery of ferroelectricity in these materials, it has opened new avenues not only redefining ferroelectric memory but also as a promising high‐k dielectric for advanced non‐volatile and volatile memory applications by utilizing specific crystalline phases to tune the electrical parameters. Various fundamental factors influencing the formation of ferroelectricity in Zr x Hf 1‐x O 2 have been identified and distinguished from those in the classical perovskite ferroelectrics. Notably, a sharp increase in the dielectric constant near 0 V observed in Zr‐rich Zr x Hf 1‐x O 2 films achieved by tuning the fabrication parameters has been attributed to the presence of a morphotropic phase boundary. This study investigates 6 nm Zr‐rich Zr x Hf 1‐x O 2 thin film metal‐insulator‐metal capacitors using a combination of experimental methods and machine learning‐based molecular dynamics simulations. The study provides insight into the physical mechanisms that enhance the dielectric constant near 0 V and attributes it to the orthorhombic phase rather than a morphotropic phase boundary. The work discusses the limitations in the practical application of the high dielectric constant observed near 0 V. Additionally, it highlights similarities and differences between Zr x Hf 1‐x O 2 and the well‐known morphotropic phase boundary in PbZr x Ti 1‐x O 3 .
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Research context
OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Ferroelectric and Piezoelectric Materials · Electronic and Structural Properties of Oxides
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
NaMLab gGmbH Noethnitzer Strasse 64a 01187 Dresden Germany
Chair of Nanoelectronics TU Dresden 01187 Dresden Germany
Munich University of Applied Sciences Loth Str. 34 80335 Munich Germany
Samsung Electronics Co., Ltd. Hwaseong 18448 Republic of Korea
Department of Materials Science and Engineering and the Materials Research Institute Pennsylvania State University University Park PA 16802 USA
Funding
Gauss Centre for Supercomputing
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