journal article·2005-02Open access

Anisotropy in the wet-etching of semiconductors

John J. Kelly, Harold G.G. Philipsen

Abstract

The surface chemistry and electrochemistry of the anisotropic etching of semiconductors are reviewed. Recent insights into the anisotropic chemical etching of silicon in alkaline solution and of electrochemical etching of anisotropic pores in n-type semiconductors are described. The possible role of galvanic effects in open-circuit etching is emphasized.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Silicon Nanostructures and Photoluminescence · Nanowire Synthesis and Applications · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (44)

Show source-provided references
1. Notten · 1991
2. Wet chemical etching of compound semiconductors
3. Elwenspoek M, Jansen H. In: Silicon micromachining, Cambridge studies in semiconductor physics and microelectronic engineering, vol. 7, 1998.
4. Wet chemical etching for V-grooves into InP substrates10.1149/1.1838739 ↗
5. Orientation-resolved chemical kinetics: using microfabrication to unravel the complicated chemistry of KOH/Si etching10.1021/jp011361j ↗
6. Macroscopic etch anisotropies and microscopic reaction mechanisms: a micromachined structure for the rapid assay of etchant anisotropy10.1016/S0039-6028(00)00479-9 ↗
7. Anisotropic etching of crystalline silicon in alkaline solutions – I – Orientation dependence and behavior of passivation layers10.1149/1.2086277 ↗
8. Time domain impedance spectroscopy for probing the termination of silicon (100) surfaces in aqueous solution10.1021/jp011754i ↗
9. Etching of silicon in NaOH solutions – II – Electrochemical studies of n-Si(111) and (100) and mechanisms of the dissolution10.1149/1.2056190 ↗
10. Anisotropy in the anodic oxidation of silicon in KOH solution10.1021/jp052595w ↗
11. Chemical etching and anodic oxidation of (100) silicon in alkaline solution: the role of applied potential10.1039/b100972i ↗
12. Reaction of water with hydrofluoric acid treated silicon(111) and (100) surfaces10.1116/1.575845 ↗
13. Characterization of chemically prepared Si-surfaces by UV–VIS and IR spectroscopic ellipsometry and surface photovoltage10.1016/S0039-6028(97)00274-4 ↗
14. Morphology of hydrogen-terminated Si(111) and Si(100) surfaces upon etching in HF and buffered-HF solutions10.1016/0039-6028(92)91363-G ↗
15. Mechanistic aspects of anisotropic dissolution of materials: etching of single-crystal silicon in alkaline solutions10.1039/a707473e ↗
16. Etching of silicon in NaOH solutions – I – In situ scanning tunneling microscopy investigation of n-Si (111)10.1149/1.2056189 ↗
17. An FTIR study of the surface chemistry of the dynamic Si(100) surface during etching in alkaline solution10.1039/b200408a ↗
18. The picture tells the story: using surface morphology to probe chemical etching reactions10.1080/01442350110071966 ↗
19. van Veenendaal E. From an atomistic to a continuum description of crystal growth – application to wet chemical etching of silicon. PhD thesis. Katholieke Universiteit Nijmegen, The Netherlands, 2001.
20. The construction of orientation-dependent crystal growth and etch rate functions – Part I – Mathematical and physical aspects10.1063/1.373602 ↗
21. The construction of orientation-dependent crystal growth and etch rate functions – Part II – Application to wet chemical etching of silicon in potassium hydroxide10.1063/1.373603 ↗
22. Micromorphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH and TMAH10.1016/S0924-4247(01)00655-0 ↗
23. Micro-morphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH: velocity source forests10.1016/S0924-4247(01)00653-7 ↗
24. Evidence for cathodic protection of crystallographic facets from GaAs etching profiles10.1149/1.2100476 ↗
25. The potential dependence of silicon anisotropic etching in KOH at 60°C10.1016/0022-0728(87)85168-9 ↗
26. Anisotropic etching of three-dimensional shapes in silicon: the important role of galvanic interaction10.1149/1.1790512 ↗
27. In-situ atomic force microscopy of silicon(100) in aqueous potassium hydroxide10.1016/S0013-4686(00)00615-0 ↗
28. The preparation of flat H–Si(111) surfaces in 40% NH4F revisited10.1016/S0013-4686(00)00610-1 ↗
29. Lehmann · 2002
30. The physics of macropore formation in low doped n-type silicon10.1149/1.2220919 ↗
31. The physics of macropore formation in low-doped p-type silicon10.1149/1.1392037 ↗
32. Processing of three-dimensional microstructures using macroporous n-type silicon10.1149/1.1836442 ↗
33. Simple cubic three-dimensional photonic crystal based on macroporous silicon and anisotropic posttreatment10.1063/1.1993752 ↗
34. Pushing the limits of macroporous silicon etching10.1007/s00339-004-3193-x ↗
35. Lehmann V. Alkaline etching of macroporous silicon membranes. Porous semiconductors-science and technology, extended abstracts 5th international conference, Sitges, Spain, I4-01, 2006. p. 49–50.
36. Hot carrier luminescence during porous etching of GaP under high electric field conditions10.1016/S0039-6028(03)00262-0 ↗
37. Fabrication of vertical and uniform-size porous InP structure by electrochemical anodization10.1143/JJAP.33.L643 ↗
38. Anisotropic refractive index of porous InP fabricated by anodization of (111)A surface10.1143/JJAP.34.177 ↗
39. Pores in III–V semiconductors10.1002/adma.200390043 ↗
40. Pore morphology and self-organization effects during etching of n-type GaP(100) in bromide solutions10.1149/1.2103507 ↗
41. High intensity and oscillatory electroluminescence observed during porous etching of GaP in HBr and HF electrolytes10.1016/j.cplett.2005.08.052 ↗
42. Crystallographic aspects of pore formation in gallium arsenide and silicon10.1080/01418619708205156 ↗
43. The formation of porous GaAs in HF solutions10.1016/S0169-4332(97)00184-0 ↗
44. Uniform and nonuniform nucleation of pores during the anodization of Si, Ge, and III–V semiconductors10.1149/1.1940847 ↗