Organic Field Effect Transistors Based on Graphene and Hexagonal Boron Nitride Heterostructures
Source abstract
Abstract
Enhancing the device performance of single crystal organic field effect transistors (OFETs) requires both optimized engineering of efficient injection of the carriers through the contact and improvement of the dielectric interface for reduction of traps and scattering centers. Since the accumulation and flow of charge carriers in operating organic FETs takes place in the first few layers of the semiconductor next to the dielectric, the mobility can be easily degraded by surface roughness, charge traps, and foreign molecules at the interface. Here, a novel structure for high‐performance rubrene OFETs is demonstrated that uses graphene and hexagonal boron nitride (hBN) as the contacting electrodes and gate dielectric layer, respectively. These hetero‐stacked OFETs are fabricated by lithography‐free dry‐transfer method that allows the transfer of graphene and hBN on top of an organic single crystal, forming atomically sharp interfaces and efficient charge carrier‐injection electrodes without damage or contamination. The resulting heterostructured OFETs exhibit both high mobility and low operating gate voltage, opening up new strategy to make high‐performance OFETs and great potential for flexible electronics.
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Research context
OpenAlex topics: Graphene research and applications · Organic Electronics and Photovoltaics · Luminescence and Fluorescent Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemistry Columbia University New York NY 10027 USA
Department of Materials Science and Engineering Yonsei University Seoul 120–749 Korea
Department of Physics Columbia University New York NY 10027 USA
Creative Research Center for Graphene Electronics Electronics and Telecommunications Research Institute(ETRI) Daejeon 305–700 Korea
National Institute for Materials Science 1–1 Namiki Tsukuba 305–0044 Japan
Department of Mechanical Engineering Columbia University New York NY 10027 USA
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