journal article·2023-10Open access

Enhancing Memory Window Efficiency of Ferroelectric Transistor for Neuromorphic Computing via Two‐Dimensional Materials Integration

Heng Xiang, Yu‐Chieh Chien, Lingqi Li, Haofei Zheng, Sifan Li, Ngoc Thanh Duong, Yufei Shi, Kah‐Wee Ang

Advanced Functional Materials· Volume 33· Issue 42

Abstract

Abstract In‐memory computing, particularly neuromorphic computing, has emerged as a promising solution to overcome the energy and time‐consuming challenges associated with the von Neumann architecture. The ferroelectric field‐effect transistor (FeFET) technology, with its fast and energy‐efficient switching and nonvolatile memory, is a potential candidate for enabling both computing and memory within a single transistor. In this study, the capabilities of an integrated ferroelectric HfO2 and 2D MoS2 channel FeFET in achieving high‐performance 4‐bit per cell memory with low variation and power consumption synapses, while retaining the ability to implement diverse learning rules, are demonstrated. Notably, this device accurately recognizes MNIST handwritten digits with over 94% accuracy using online training mode. These results highlight the potential of FeFET‐based in‐memory computing for future neuromorphic computing applications.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Advanced Memory and Neural Computing · 2D Materials and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical and Computer Engineering National University of Singapore 4 Engineering Drive 3 Singapore 117583 Singapore

Funding

Science and Engineering Research Council · National Research Foundation Singapore

References (51)

Show source-provided references
1. 10.1038/s43588-021-00184-y10.1038/s43588-021-00184-y ↗
2. 10.1038/s41586-019-1677-210.1038/s41586-019-1677-2 ↗
3. 10.1002/admt.20180058910.1002/admt.201800589 ↗
4. 10.1038/s41565-023-01343-010.1038/s41565-023-01343-0 ↗
5. 10.1038/s41565-020-0724-310.1038/s41565-020-0724-3 ↗
6. 10.1038/natrevmats.2016.8710.1038/natrevmats.2016.87 ↗
7. 10.1038/s41578-022-00431-210.1038/s41578-022-00431-2 ↗
8. 10.1109/MNANO.2021.309821810.1109/MNANO.2021.3098218 ↗
9. 10.1002/adma.20220490410.1002/adma.202204904 ↗
10. 10.1002/adma.20090432710.1002/adma.200904327 ↗
11. 10.1038/s41928-020-00492-710.1038/s41928-020-00492-7 ↗
12. 10.1021/nl302049k10.1021/nl302049k ↗
13. 10.1063/1.501709410.1063/1.5017094 ↗
14. 10.1038/s41586-020-2208-x10.1038/s41586-020-2208-x ↗
15. 10.1002/aelm.20210049910.1002/aelm.202100499 ↗
16. 10.1109/LED.2002.101520710.1109/LED.2002.1015207 ↗
17. 10.1109/LED.2020.301103710.1109/LED.2020.3011037 ↗
18. 10.1109/TED.2020.297614810.1109/TED.2020.2976148 ↗
19. 10.1109/JPROC.2023.323460710.1109/JPROC.2023.3234607 ↗
20. S.De M.Lederer Y.Raffel F.Müller K.Seidel T.Kämpfe 2022 19th International SoC Design Conference (ISOCC) IEEE Korea2022 167.10.1109/ISOCC56007.2022.10031437 ↗
21. 10.1002/adma.20200562010.1002/adma.202005620 ↗
22. 10.1002/adfm.20160409310.1002/adfm.201604093 ↗
23. 10.1038/s41467-018-03824-610.1038/s41467-018-03824-6 ↗
24. 10.1002/aelm.20160040010.1002/aelm.201600400 ↗
25. 10.1038/s41928-021-00670-110.1038/s41928-021-00670-1 ↗
26. 10.1038/natrevmats.2016.5210.1038/natrevmats.2016.52 ↗
27. 10.1002/adfm.20211026310.1002/adfm.202110263 ↗
28. 10.1109/TED.2020.300962310.1109/TED.2020.3009623 ↗
29. 10.1109/TED.2020.300995610.1109/TED.2020.3009956 ↗
30. 10.1021/acsami.6b1386610.1021/acsami.6b13866 ↗
31. 10.1002/adma.20220494910.1002/adma.202204949 ↗
32. 10.1103/PhysRevLett.99.26760210.1103/PhysRevLett.99.267602 ↗
33. 10.1103/PhysRevB.66.21410910.1103/PhysRevB.66.214109 ↗
34. 10.1063/1.501020710.1063/1.5010207 ↗
35. 10.1002/adfm.20210887610.1002/adfm.202108876 ↗
36. Wei W. · 2021
37. 10.1021/acsami.5b0577310.1021/acsami.5b05773 ↗
38. 10.1002/adfm.20160059010.1002/adfm.201600590 ↗
39. 10.1021/acsaelm.1c0033010.1021/acsaelm.1c00330 ↗
40. 10.1002/aelm.20200026410.1002/aelm.202000264 ↗
41. 10.1063/5.002961110.1063/5.0029611 ↗
42. 10.1038/s41563-022-01282-610.1038/s41563-022-01282-6 ↗
43. 10.1038/s41565-017-0010-110.1038/s41565-017-0010-1 ↗
44. H.Mulaosmanovic S.Slesazeck J.Ocker M.Pesic S.Muller S.Flachowsky J.Müller P.Polakowski J.Paul S.Jansen S.Kolodinski C.Richter S.Piontek T.Schenk A.Kersch C.Kunneth R.vanBentum U.Schroder T.Mikolajick in2015 IEEE International Electron Devices Meeting (IEDM)2015 p.26.8.1.10.1109/IEDM.2015.7409777 ↗
45. S.Dutta H.Ye W.Chakraborty Y. C.Luo M. S.Jose B.Grisafe A.Khanna I.Lightcap S.Shinde S.Yu S.Datta in2020 IEEE International Electron Devices Meeting (IEDM)2020 p.36.4.1‐36.4.4.10.1109/IEDM13553.2020.9371974 ↗
46. 10.1002/adfm.20201107710.1002/adfm.202011077 ↗
47. M.Jerry P. Y.Chen J.Zhang P.Sharma K.Ni S.Yu S.Datta in2017 IEEE International Electron Devices Meeting (IEDM)2017 p.6.2.1–6.2.4.
48. H.Mulaosmanovic J.Ocker S.Müller M.Noack J.Müller P.Polakowski T.Mikolajick S.Slesazeck in2017 Symposium on VLSI Technology2017 pp.T176.10.23919/VLSIT.2017.7998165 ↗
49. 10.1088/2053-1583/ab23ba10.1088/2053-1583/ab23ba ↗
50. 10.1039/D0NR02401E10.1039/D0NR02401E ↗
51. P. Y.Chen X.Peng S.Yu in2017 IEEE International Electron Devices Meeting (IEDM)2017 p.6.1.1–6.1.4.