journal article·2018-11

Mechanically Guided Post‐Assembly of 3D Electronic Systems

Bong Hoon Kim, Fei Liu, Yongjoon Yu, Hokyung Jang, Zhaoqian Xie, Kan Li, Jungyup Lee, Ji Yoon Jeong, Arin Ryu, Yechan Lee, Do Hoon Kim, Xueju Wang, KunHyuck Lee, Jong Yoon Lee, Sang Min Won, Nuri Oh, Jeonghyun Kim, Ju Young Kim, Seong‐Jun Jeong, Kyung‐In Jang, Seungmin Lee, Yonggang Huang, Yihui Zhang, John A. Rogers

Advanced Functional Materials· Volume 28· Issue 48
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Abstract

Abstract This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off‐the‐shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out‐of‐plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near‐field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state‐of‐the‐art components.
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Research context

OpenAlex topics: Advanced Materials and Mechanics · Modular Robots and Swarm Intelligence · Additive Manufacturing and 3D Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Center for Mechanics and Materials Center for Flexible Electronics Technology AML, Department of Engineering Mechanics Tsinghua University Beijing 100084 China

Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

Department of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering Northwestern University Evanston IL 60208 USA

AML, Department of Engineering Mechanics Center for Mechanics and Materials Tsinghua University Beijing 100084 China

Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea

Department of Electronics Convergence Engineering Kwangwoon University Seoul 01897 Republic of Korea

Multidisciplinary Sensor Research Group Electronics and Telecommunications Research Institute (ETRI) Daejeon 34129 Republic of Korea

Department of Organic Materials and Fiber Engineering Department of Information Communication Materials, and Chemistry Convergence Technology Soongsil University 369 Sangdo‐ro Dongjak‐gu Seoul 06978 Republic of Korea

Department of Robotics Engineering Daegu Gyeongbuk Institute of Science and Technology (DGIST) Daegu 42988 Republic of Korea

Department of Energy Electronics Convergence Kookmin University Seoul 02707 Republic of Korea

Department of Civil and Environmental Engineering Mechanical Engineering Materials Science and Engineering Northwestern University Evanston IL 60208 USA

Department of Materials Science and Engineering Department of Biomedical Engineering Department of Chemistry Department of Neurological Surgery Department of Mechanical Engineering Department of Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Funding

National Science Foundation · National Natural Science Foundation of China · Tsinghua National Laboratory for Information Science and Technology

References (50)

Show source-provided references
1. 10.1002/adem.20150009110.1002/adem.201500091 ↗
2. 10.1002/adma.20050043810.1002/adma.200500438 ↗
3. 10.1002/adma.20140164210.1002/adma.201401642 ↗
4. 10.1002/adfm.20100174610.1002/adfm.201001746 ↗
5. 10.1002/adfm.20170180710.1002/adfm.201701807 ↗
6. 10.1038/ncomms961210.1038/ncomms9612 ↗
7. 10.1126/science.116837510.1126/science.1168375 ↗
8. 10.1126/sciadv.160280010.1126/sciadv.1602800 ↗
9. 10.1038/ncomms796210.1038/ncomms7962 ↗
10. 10.1002/aenm.20170012710.1002/aenm.201700127 ↗
11. 10.1002/adma.20170381710.1002/adma.201703817 ↗
12. 10.1021/acsnano.6b0727410.1021/acsnano.6b07274 ↗
13. 10.1021/nl503329210.1021/nl5033292 ↗
14. 10.1002/adma.20140080410.1002/adma.201400804 ↗
15. 10.1038/nmat478210.1038/nmat4782 ↗
16. 10.1038/ncomms1092910.1038/ncomms10929 ↗
17. 10.1038/ncomms414010.1038/ncomms4140 ↗
18. 10.1103/PhysRevLett.114.05550310.1103/PhysRevLett.114.055503 ↗
19. 10.1126/science.125287610.1126/science.1252876 ↗
20. 10.1038/nmat454010.1038/nmat4540 ↗
21. 10.1557/mrs.2016.210.1557/mrs.2016.2 ↗
22. 10.1016/j.eml.2016.04.00510.1016/j.eml.2016.04.005 ↗
23. 10.1021/nl502636910.1021/nl5026369 ↗
24. 10.1126/science.aan562710.1126/science.aan5627 ↗
25. 10.1557/mrs.2016.410.1557/mrs.2016.4 ↗
26. 10.1002/adma.20170503410.1002/adma.201705034 ↗
27. 10.1038/nmeth.123610.1038/nmeth.1236 ↗
28. 10.1002/smll.20170385210.1002/smll.201703852 ↗
29. 10.1126/science.126096010.1126/science.1260960 ↗
30. 10.1038/natrevmats.2017.1910.1038/natrevmats.2017.19 ↗
31. 10.1073/pnas.151560211210.1073/pnas.1515602112 ↗
32. 10.1016/j.microrel.2011.11.00310.1016/j.microrel.2011.11.003 ↗
33. 10.1007/s12274-014-0555-310.1007/s12274-014-0555-3 ↗
34. 10.1126/sciadv.160101410.1126/sciadv.1601014 ↗
35. 10.1038/nnano.2006.13110.1038/nnano.2006.131 ↗
36. 10.1002/adfm.20150490110.1002/adfm.201504901 ↗
37. 10.1038/ncomms1589410.1038/ncomms15894 ↗
38. 10.1038/ncomms756610.1038/ncomms7566 ↗
39. Dupont Kapton Summary of Properties http://www.dupont.com/content/dam/dupont/products‐and‐services/membranes‐and‐films/polyimde‐films/documents/DEC‐Kapton‐summary‐of‐properties.pdf (accessed: January2018).
40. 10.1002/adma.20120027210.1002/adma.201200272 ↗
41. 10.1002/adma.20090420110.1002/adma.200904201 ↗
42. 10.1038/ncomms255310.1038/ncomms2553 ↗
43. 10.1038/s41563-017-0011-310.1038/s41563-017-0011-3 ↗
44. 10.1073/pnas.151560211210.1073/pnas.1515602112 ↗
45. 10.1126/scitranslmed.aan495010.1126/scitranslmed.aan4950 ↗
46. 10.1073/pnas.111656410810.1073/pnas.1116564108 ↗
47. 10.1073/pnas.171791211510.1073/pnas.1717912115 ↗
48. 10.1002/adfm.20160591410.1002/adfm.201605914 ↗
49. 10.1002/adma.20140180410.1002/adma.201401804 ↗
50. 10.1002/adma.20150459010.1002/adma.201504590 ↗