Dielectric Properties of a Printed Sol–Gel Matrix Composite
Source abstract
Abstract
Abstract Low temperature processable materials with high dielectric constants are required for application on flexible organic substrates, for example, in printed electronics. To date, mainly organic polymers with embedded functional particles have been investigated for this purpose. For the first time, we present a printable dielectric composite material composed of ferroelectric high permittivity particles (BaTiO3) bonded by a mainly inorganic sol–gel derived network. The exemplary optimization of the properties by varying the sol–gel precursor illustrates the potential of sol–gel chemistry for printable functional materials. An operational gravure printed capacitor including printed silver electrodes is presented. The measured dielectric constants are among the highest reported in literature for low temperature cured films with moderate dissipation factors. Besides these promising dielectric properties, this composite film shows a ferroelectric response.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Dielectric materials and actuators · Advanced Sensor and Energy Harvesting Materials · Synthesis and properties of polymers
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (40)
Show source-provided references
1. 10.1038/nmat181710.1038/nmat1817 ↗
2. Logothetidis S. · Eur. Phys. J. Appl. Phys. · 2009 · 46
3. 10.1002/adma.20050051710.1002/adma.200500517 ↗
4. Kim P. · Appl. Phys. Lett. · 2008 · 93
5. 10.1016/j.mseb.2004.01.02210.1016/j.mseb.2004.01.022 ↗
6. 10.1002/app.2851510.1002/app.28515 ↗
7. 10.1063/1.33121110.1063/1.331211 ↗
8. Nhuapeng W. · CMU J. · 2002 · 1
9. 10.1016/j.mseb.2005.10.02210.1016/j.mseb.2005.10.022 ↗
10. 10.1111/j.1551-2916.2008.02387.x10.1111/j.1551-2916.2008.02387.x ↗
11. 10.1002/pen.1143810.1002/pen.11438 ↗
12. 10.1016/S0924-4247(97)01685-310.1016/S0924-4247(97)01685-3 ↗
13. 10.1016/j.compositesa.2005.03.00710.1016/j.compositesa.2005.03.007 ↗
14. 10.1063/1.322332310.1063/1.3223323 ↗
15. 10.1016/j.actamat.2006.02.03110.1016/j.actamat.2006.02.031 ↗
16. 10.1016/j.matlet.2006.05.06110.1016/j.matlet.2006.05.061 ↗
17. 10.1088/0022-3727/35/16/32110.1088/0022-3727/35/16/321 ↗
18. 10.1007/s10854-005-6454-310.1007/s10854-005-6454-3 ↗
19. 10.1063/1.218803210.1063/1.2188032 ↗
20. 10.1021/cm900532q10.1021/cm900532q ↗
21. 10.1021/cm802845s10.1021/cm802845s ↗
22. Tiefensee F. · Ultrasonics · 2010
23. F.Tiefensee C.Becker‐Willinger G.Heppe P.Herbeck‐Engel Germany Patent Application DE102008014120A1 2009.
24. 10.1002/adem.20040007810.1002/adem.200400078 ↗
25. 10.1063/1.36417210.1063/1.364172 ↗
26. 10.1143/JJAP.41.696910.1143/JJAP.41.6969 ↗
27. 10.1023/A:100457890529710.1023/A:1004578905297 ↗
28. 10.1088/0022-3727/31/13/00610.1088/0022-3727/31/13/006 ↗
29. Tahan D. · 1994
30. 10.1143/JJAP.32.409210.1143/JJAP.32.4092 ↗
31. Cruz D. H. · 2002
32. 10.1023/A:100861922262110.1023/A:1008619222621 ↗
33. 10.1016/S0955-2219(01)00260-610.1016/S0955-2219(01)00260-6 ↗
34. 10.1080/1058458049045876610.1080/10584580490458766 ↗
35. 10.1016/j.jallcom.2006.12.11510.1016/j.jallcom.2006.12.115 ↗
36. 10.1111/j.1551-2916.2007.01742.x10.1111/j.1551-2916.2007.01742.x ↗
37. 10.1016/j.materresbull.2008.12.00710.1016/j.materresbull.2008.12.007 ↗
38. 10.1021/j100033a00210.1021/j100033a002 ↗
39. 10.1063/1.35405710.1063/1.354057 ↗
40. 10.1007/s10832-005-1460-710.1007/s10832-005-1460-7 ↗