Effect of the Oxygen Composition Control of HfOx Films on Threshold and Memory Switching Characteristics for Hybrid Memory Applications
Source abstract
Abstract
Abstract Considering a high‐density vertical X‐point memory array, the film thickness of an active device for the selector and memory needs to be scaled down. Here, the authors propose an AgTe/HfOx‐based hybrid memory device with a film thickness of less than 10 nm by adopting a bilayer (HfO1.8/HfO2) film using precise composition control. Non‐volatile switching characteristics can be obtained by considering the formation of stable nanoscale Ag filaments in the nanoporous region in non‐stoichiometric HfO1.8 deposited via sputtering. By contrast, volatile switching characteristics are achieved by an unstable atomic‐scale Ag path in stoichiometric HfO2 deposited via plasma‐enhanced atomic layer deposition. Based on density functional theory calculations, it is confirmed that the stoichiometry of the HfOx film is the key parameter that controls the switching characteristics. The bilayer (HfO1.8/HfO2) device exhibits excellent hybrid memory characteristics, such as distinct read margin (>1.5 V), high ON/OFF ratio (>106), and extremely low OFF current (≈pA), for vertical X‐point memory applications.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Center for Single Atom‐based Semiconductor Device Department of Material Science and Engineering Pohang University of Science and Technology (POSTECH) Pohang 790‐784 Republic of Korea
Department of Materials Science and Engineering and Division of Advanced Materials Science Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea
Funding
Semiconductor Research Corporation
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